Silver Platinum Slurry - YB8303

Silver platinum paste is an electronic material with excellent conductivity, solder resistance, and oxidation resistance, widely used in the electronics and electrical industries. Its unique physical and chemical properties and wide range of applications make it one of the indispensable and important materials in modern industry.


Product Features

Main component: Silver platinum alloy, with platinum content usually less than 5%. The combination of this alloy gives silver platinum paste unique physical and chemical properties.

Conductivity: Silver platinum paste has excellent conductivity and can meet the demand for high conductivity in the electronics and electrical industries.

Solder resistance: The addition of platinum significantly improves the solder resistance of the slurry, making it perform well in high-temperature welding environments.

Oxidation resistance: The sintered silver platinum alloy conductive film has good oxidation resistance and can resist the influence of oxidation to a certain extent.

Other characteristics: Silver platinum paste also has good solderability and resistance to solder corrosion, with high initial adhesion. However, it is not suitable for low melting eutectic welding with silicon wafers.

Production process

Preparation: Mix silver platinum alloy powder, binder, solvent, and additives in specific proportions.

Printing: Using screen printing technology to print the paste onto the substrate.

Drying: Dry at an appropriate temperature to remove solvents.

Sintering: Sintering is carried out at high temperature to tightly bond the silver platinum alloy with the substrate.

Workshop Display