Inner layer printing silver paste

Inner layer printed silver paste is a material specifically used for printing conductive lines inside multi-layer printed circuit boards (PCBs). This silver paste is commonly used to manufacture complex multilayer circuit boards, where conductive lines exist not only in the outermost layer but also between the inner layers

Product Features

Conductivity: The inner layer printed silver paste has excellent conductivity, and the resistance value of its conductive layer is small, which helps to improve the stability of signal transmission and circuit performance.

Plasticity: Due to the good plasticity of the inner layer printed silver paste, it can adapt to the design requirements of complex circuits, ensuring the reliability and stability of circuit connections.

Stability and rheological properties: During preparation and use, it is necessary to strictly control the stability and rheological properties of silver paste. Stability refers to the dispersion stability of silver powder in solvents, while rheology refers to the viscosity and other flowability properties of silver paste. The improvement of these two aspects helps to enhance the uniformity and accuracy of printing.

Development Trends

Technological improvement and innovation: With the continuous advancement of technology, the preparation technology of inner layer printing silver paste will continue to improve, including the refinement of silver powder particles, innovative application of additives, etc., to improve the conductivity, adhesion, and printing suitability of silver paste.

Environmental Protection and Sustainable Development: The increasing awareness of environmental protection will promote the development of inner layer printing silver paste towards a more environmentally friendly and sustainable direction, such as developing organic carriers with low VOC (volatile organic compounds) to reduce environmental pollution during production and use.

Multifunctionality: In the future, inner layer printing silver paste may not only be limited to conductive functions, but will also develop towards multifunctionality, such as combining anti-static, wear-resistant, corrosion-resistant and other characteristics to meet the demand for high-performance materials in electronic products.

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