Thick film hybrid integrated circuit silver palladium paste

Thick film hybrid integrated circuit silver palladium paste is a conductive paste containing silver and palladium, widely used in the manufacturing of thick film hybrid integrated circuits. It is made by mixing and dispersing metal powders such as silver and palladium with organic carriers, glass powders, etc. into a paste, which has excellent conductivity and stability.

Product Features

Excellent conductivity: Silver palladium paste has low resistivity and good conductivity, which can ensure stable transmission of electronic signals in thick film hybrid integrated circuits.

High adhesion: Silver palladium paste can firmly adhere to ceramic substrates and other substrates after sintering, forming reliable conductive connections.

Good stability: The addition of palladium improves the oxidation resistance and corrosion resistance of the slurry, and can maintain stable conductivity in harsh environments.

Process controllability: The viscosity, fineness, and other parameters of silver palladium slurry can be adjusted according to specific process requirements to adapt to different printing and sintering processes.

Production process

Printability: It has good printing performance and is easy to coat through methods such as screen printing.

Sintering conditions: Sintering is carried out under specific temperature conditions to ensure good bonding strength and electrical properties.

Heat resistance: Silver palladium paste has excellent heat resistance and can work at high temperatures without losing its conductivity.

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