Thick film integrated circuit platinum electrode paste

Platinum electrode paste in thick film integrated circuits is mainly used to manufacture conductive paths, connection points, and electrodes in integrated circuits. This slurry is usually composed of platinum powder, binder (such as glass powder), organic carrier (solvent), and other additives.

Product Features

Conductivity: Platinum is an excellent conductive material that can provide good conductivity.

Chemical stability: Platinum has excellent chemical stability, is not easily corroded, and is suitable for use in harsh environments.

Thermal stability: able to maintain stability at high temperatures, suitable for high-temperature sintering processes.

Printability: It has good printing performance and can be precision printed using techniques such as screen printing.

Adhesive strength: There is good adhesion between the substrate (such as ceramic substrate).

Production process

Slurry preparation: Mix platinum powder, binder, solvent and other components in a certain proportion.

Printing or coating: Use a screen printing machine to print the slurry onto a ceramic substrate.

Drying: Pre drying at lower temperatures to remove excess solvents.

Sintering: Sintering is carried out at high temperature to solidify the slurry and tightly bond it with the substrate.

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