High purity antimony plating by magnetron sputtering

The principles and processes of the advanced house of science and technology magnetic control sputtering high -purity (SB) are as follows:

1. Principles: Magnetic sputtering is a technology that uses magnetic control electron beams or ion beam to bombard the target, which techniques that make the atom or ion on the surface of the target surface from and deposit on the substrate. By controlling sputtering conditions and target components, a high -purity sedimentary membrane can be obtained.

2. Splash process: Magnetic sputtering coating usually includes a target, substrate and cathode composition. The target is a target material that requires deposits, usually a metal or compound with higher purity. The substrate is an object that requires coating, which can be metal, plastic or glass. The cathode is the source of electronic beams or ion beams.

3. Material preparation: First of all, you need to prepare a high -purity target. The higher the purity of the target, the purity of the sedimentary membrane will be improved accordingly. You can prepare the target through the chemical purity.

4. Set sputtering parameters: You need to set some parameters during sputtering, including sputtering power, gas pressure, sputtering time, etc. Splane power and gas pressure can affect the spatial rate and the properties of the membrane. Appropriate sputtering time can control the thickness of the deposits.

5. Clean the substrate: Before sputtering, the substrate needs to be thoroughly cleaned to ensure the adhesion and purity of the membrane layer. Common methods include ultrasonic cleaning, solvent cleaning and vacuum drying.

6. Start sputtering: Place the target and substrate in the vacuum chamber to ensure that the indoor vacuum is required, and start sputtering. During the sputtering process of magnetic control, the target was bombarded by electronic beams or ion beams, leaving the atom or ions on the surface of the target's surface out of the substrate. During sputtering, the distance between the appropriate target and the substrate needs to be maintained, and the appropriate target rotation speed to ensure uniform coating.

7. Control the purity of the membrane layer: During the sputtering process, the purity of the sedimentary membrane layer can be regulated by controlling sputtering power, gas pressure, and target purity. In addition, you can further control the purity of the membrane layer by adding an appropriate amount of gas or measuring the composition of the membrane layer.

Summary: Magnetic sputtering high -purity 锑 is a process that uses magnetic fields to control electron beams or ion beams to bombard the target, so that the atom or ion on the surface of the target surface is separated from and deposited on the substrate. By preparation of appropriate sputtering parameters and materials, a high -purity membrane layer can be prepared.