High purity manganese plating by magnetron sputtering

Magnetic sputtering high -pure manganese (MN) is a commonly used surface coating technology that is suitable for various fields, such as electronics, optics and material science. Magnetic sputtering is a physical gas sedimentation (PVD) technology that uses external plus magnetic fields to make accurate and dense coatings on the target surface.

For the preparation of high -purity manganese plating, the magnetic sputtering method can achieve high -purity coating. The preparation steps include: First, place the target material (manganese with higher purity) in the sputtering target, usually a solid target; then Under vacuum conditions, the heating system transforms target materials into ion state by heat evaporation or electron beam; then, the introduction of inert gas (usually sorchium) as a working gas to form plasma; Control the orbit of the ions, so that it is deposited on the surface of the substrate to form a high -purity manganese plating layer.

Magnetic sputtering high -pure manganese can have many advantages, including high adhesion, uniform coating distribution, and good chemical stability. This technology can also achieve precise control of plating characteristics by regulating parameters such as target temperature, gas pressure and sputtering voltage. These characteristics make magnetic control sputtering high -pure manganese widely used in a series of applications, such as functional thin film such as protective layers, optical applications, and material research of electronic devices.