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先进院（深圳）科技有限公司

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Company news

2025-02-10Preparation method of chip resistor paste: strategy for achieving low resistance and high compatibility
2025-02-08Analysis of the changes in absorption performance of coating absorbing materials in humid environments
2025-02-08Technical exploration of low permeability absorbing materials to overcome the problem of electromagnetic wave reflection enhancement
2025-02-07What are the electrical properties of PET silver plated reflective film and is it suitable for electronic or electrical applications
2025-02-07What are the difficulties in magnetron sputtering double-sided copper plating process for gold-plated copper foil?
2025-02-06The relationship between the mechanical strength of the cured layer and the additives in the solderable conductive copper paste
2025-02-06Solving the agglomeration problem of pressureless sintered nano copper paste during storage
2025-01-22Technical difficulties in the preparation process of absorbing materials for mobile phone magnetic isolation sheets
2025-01-21Enhance the resistance of PET gold-plated reflective film to ultraviolet (UV) radiation
2025-01-21Performance change characteristics of aluminum layer of PET aluminum plated film under ultraviolet light irradiation
2024-10-12The influence of formulation composition of low-temperature curing silver adhesive on its curing temperature range
2024-10-07Is conductive silver adhesive suitable for all metal surfaces?
2024-10-06Research on the Main Components and Optimal Proportions of Platinum Conductor Slurry
2024-10-06Study on the Radiation Resistance of PI Silver Plated Film in Radiation Environment
2024-09-28Study on post-treatment of PET film after nickel plating to enhance its performance
2024-09-28Notes on the use of ruthenium dioxide in the production of chip resistor paste
2024-09-27Application of PI silver plated film in the field of flexible electronics: achieving thinner, more durable device design
2024-09-26Method for determining the curing or sintering temperature and time of platinum conductor paste
2024-09-25镀铜液的温度、pH值和电流密度精确控制对镀层质量的影响研究
2024-09-24银钯导体浆料中银钯比例对电导性的影响分析
2024-09-24​研铂牌YB6016低温固化银胶在不同基材上的相容性研究
2024-09-21PI镀锡膜与其他镀层（镀金膜、镀银膜等）的兼容性探究
2024-09-21不同镀金工艺对PI镀金膜性能的差异
2024-09-19铂导体浆料的主要成分及其最佳配比技术探讨
2024-09-19导电银胶的导电性能及在高精度电子应用中的表现
2024-09-18超细铜粉的粒度对其在导电材料中的应用影响分析
2024-09-18超细金粉：物理特性的深度剖析与独特应用
2024-09-14LED线路板导电铜浆的应用及性能分析——研铂牌YB5103
2024-09-14各类镀金膜产品及其性能的解析
2024-09-14镀金膜技术的创新突破与多元应用
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