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先进院（深圳）科技有限公司

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Precious metal paste

2023-09-07YB-1098——一种先进的可焊性印刷铜浆
2023-09-07贯孔银浆：提升电路板可靠性的先进解决方案
2023-09-07先进院科技导电塞孔银浆 YB-5020：提高产品可靠性的首选材料
2023-09-07先进院科技推出的导电塞孔银浆YB-5020是一种具有高度可靠性的塞孔用银浆材料
2023-09-07耐弯折丝网印刷银浆：开启高精度印刷新时代
2023-09-07耐弯折丝网印刷银浆
2023-09-07补线银浆：提高PCB板厂效率的利器
2023-09-06金属网格填缝的银浆（如先进院科技YB-5016）被认为是制作大型触控屏幕的首选
2023-09-06Metal Grid Joint Filling Silver Paste - Advanced Institute Technology YB-5016
2023-09-06高效能导电银胶——实现电子设备的高效连接与修复
2023-09-06银钯导体浆料在厚膜电路和相关分离元器件的生产制备中扮演着重要的角色
2023-09-06银钯导体浆料：为高效厚膜电路制备的理想选择
2023-09-06银铂导体浆料主要应用于电路生产引进线、厚膜导体和玻璃釉电位器端头的导体制作中
2023-09-06优质银铂导体浆料YB-5017：坚固的导体，广泛应用于电路生产！
2023-09-06先进院科技 YB-5500 电阻调节浆料——高效制备正温度系数热敏电阻膜
2023-09-06超细金粉：为金导体浆料与金粘接浆料的完美选择
2023-09-05Ultra fine platinum powder: a huge transformation for your electrode slurry
2023-09-05Ultra fine platinum powder: the preferred material for high-performance electrodes
2023-09-05Ultra fine palladium powder - a high-end silver palladium slurry that opens up a new era
2023-09-05Ultra fine palladium powder is a high-quality metal powder product with excellent chemical stability, thermal stability, and electrical conductivity
2023-09-05Fine silver powder: an ideal choice for high-temperature sintering and silver paste for car glass
2023-09-05Flake silver powder: showcasing a new era of low-temperature curing electronic pastes
2023-09-05Flake silver powder is a product commonly used in low-temperature curing electronic pastes
2023-09-05超细二氧化钌粉：探索材料创新的前沿利器
2023-09-05YB-6002粘结银导电胶是一款优秀的有机聚合物银浆料
2023-09-04填孔金浆-YB-8815金导体浆料广泛应用于氧化铝基板上的通孔填补
2023-09-04YB-8810: 创新薄型印刷金浆的高效附着力
2023-09-04键合金浆是一种用于在96瓷或多层介质上粘附金丝的金属浆料
2023-09-04Alloy gold paste sintered at 850 ° C
2023-09-04The curing time of conductive silver paste is related to the thickness of the coating, and it can fully conduct and bond after 24 hours at room temperature
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