Company News Advanced Institute (Shenzhen) Technology Co., Ltd

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Advanced Institute (Shenzhen) Technology Co., Ltd

Study on the Conductivity and Influencing Factors of Nickel Coating on PEN Thin Film

Study on the chemical stability of PI nickel plating film when in contact with other materials

Discussion on the theoretical upper limit of electrode conductivity of silver platinum electrode paste for sensors

Long term stability and degradation mechanism analysis of printing platinum paste

Strategy for reducing the manufacturing cost of platinum electrode slurry through continuous research and innovation

Magnetic permeability parameter control in the preparation of high permeability absorbing materials

What are the weather resistance and corrosion resistance of electromagnetic protective absorbing coatings

Application potential and preparation method of PP copper plated film in negative electrode current collector of lithium-ion batteries

Study on the toughness performance of PEN silver plated film at low temperature

Challenges and solutions for maintaining glossiness of PP silver plated film coating after long-term use

Changes in Bonding Effect of Surface Bond Alloy Slurry under Different Humidity

How to prevent oxidation and contamination of surface welding gold paste during the welding process

Improve the adhesion and conductivity of through-hole filling gold paste on alumina substrate

Correlation analysis between the absorption performance of graphene absorbing materials and the content and number of graphene layers

How to determine the absorption frequency range of mobile phone magnetic film absorbing materials

Uniform deposition technology and influencing factors of nano gold particles on PP film surface

Degradation of conductivity of PI gold plating film during long-term use and preventive measures

Enhanced adhesion technology of touch screen conductive silver adhesive: key to adapting to substrates of different materials

How to Ensure Signal Transmission Stability in High Frequency Environment with RFID Conductive Silver Adhesive
Industry news

How to avoid the generation of tin slag during the PI tin plating manufacturing process?

What factors can reduce the electromagnetic shielding performance of PP nickel plating film

The effect of conductivity of silver palladium paste on the heating performance of heater components?

How to avoid interlayer contamination of co fired platinum electrode slurry during multi-layer co firing process?

How to optimize the electromagnetic loss mechanism of low permeability absorbing materials to improve absorption efficiency?

How to improve the flexibility and durability of rubber patch type absorbing materials?

How to evaluate the flexibility and bendability of PET copper plated film for different application scenarios?

How to avoid coating damage during the use of PI silver plated film?

How stable is the surface bonding alloy slurry at high temperatures?

Solving the adhesion problem of printing gold paste on complex substrates

How to reduce the surface resistance of magnetic loaded rubber absorbing materials to minimize electromagnetic wave reflection?

In which electromagnetic devices are high permeability and low loss magnetic separators widely used?

How to optimize the heat dissipation effect of gold-plated copper foil when used for heat dissipation components?

How does the conductivity of PET gold plating film vary with the thickness of the gold plating layer?

How to enhance the weather resistance of high-temperature conductive silver adhesive?

How to effectively reduce the problem of sintering cracks in pressure sintered silver paste?

Addressing the Performance Stability of Thin Film Absorbing Materials in Long Term Use

How to apply low permeability absorbing materials to electromagnetic pollution prevention to improve environmental quality?

How to reduce signal loss when using gold-plated copper foil in high-frequency circuits?

Research on Dispersion and Stability Technology of Nanoscale Aluminum Particles in PET Aluminum Coating Preparation
Company news

Research on the Causes and Prevention Techniques of Surface Defects on Nickel Plated Copper Foil

How to avoid electrostatic interference on PET nickel plating film during use

Analysis of the difficulties in the application of silver palladium paste in filter circuits in thick film hybrid integrated circuits

Technical exploration on enhancing the adhesion of platinum conductor paste after solidification or sintering

Thin film absorbing materials: a technical strategy to reduce surface resistance and minimize electromagnetic wave reflection

How to improve the electromagnetic loss mechanism of NFC anti metal absorbing materials

Addressing the brittleness issue of coating absorbing materials in low-temperature environments

Ways to improve the heat resistance of PI copper plated film and testing methods

The influence of surface roughness of PET silver plated reflective film on its reflective performance

Technical exploration of improving the electronic transmission efficiency limit of gold conductor paste

Addressing the issue of incomplete penetration during welding of weldable gold platinum palladium paste

How to ensure the complete coating of coating absorbing materials on complex shaped substrates

How to avoid static accumulation of LCP film gold plating material during use

Resolve the performance stability of PET gold-plated reflective film in high or low temperature environments

What are the key factors in the high conductivity design of low-temperature conductive silver paste

Improve the antioxidant performance of conductive silver paste in integrated circuits

The service life and replacement cycle of radar absorbing materials

How to adapt coating absorbing materials to the adhesion requirements of different substrates

How to maintain the performance stability of NFC anti metal absorbing materials in long-term use

The flexibility of tinned copper foil and its advantages in the manufacturing of flexible circuit boards

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