In the manufacturing of electronic components, multi-layer co firing technology is widely used to prepare high-performance ceramic substrates and multi-layer chip components.
Co fired platinum electrode slurryDue to its excellent conductivity and chemical stability, it has become a commonly used material. However, during the multi-layer co firing process, interlayer contamination issues often occur, seriously affecting product performance and reliability. Advanced Institute (Shenzhen) Technology Co., Ltd. has invested a lot of research in solving this technical problem and achieved a series of results.
1、 The causes of interlayer pollution
（1） Element diffusion
During high-temperature co firing, certain elements in the platinum electrode slurry, such as alkali metal elements in the flux, will diffuse towards adjacent ceramic layers due to thermal driving. After these elements enter the ceramic lattice, they may alter the electrical and physical properties of the ceramic, leading to a decrease in interlayer insulation performance. For example, the diffusion of sodium ions into the ceramic layer can increase the ion conductivity of the ceramic and cause problems such as leakage.
（2） Volatility and redeposition
During the co firing process, organic additives and some low melting point components in the platinum electrode slurry will evaporate. These volatile compounds migrate in the furnace atmosphere, and if not discharged in a timely manner, they may re deposit on the surface of the ceramic layer in areas with lower temperatures, forming a fouling layer that affects interlayer bonding and electrical performance.
2、 Solution Strategy of Advanced Institute (Shenzhen) Technology Co., Ltd
（1） Optimize the slurry formula
The R&D team of Advanced Institute (Shenzhen) Technology Co., Ltd. has been adjusted
Platinum electrode slurryThe formula reduces the components that are prone to diffusion and volatilization. They adopted a new low diffusion flux system, reduced the content of alkali metal elements, and optimized the types and proportions of organic additives. For example, using organic carriers with higher thermal stability to reduce their volatilization during co firing. After multiple experimental optimizations, a new platinum electrode slurry has been developed, which effectively inhibits element diffusion and volatilization, significantly reducing the risk of interlayer pollution.
（2） Improve process control
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Heating rate control: Accurately controlling the heating rate of the co firing process is crucial.Advanced Institute (Shenzhen) Technology Co., LtdResearch has found that a rapid heating rate can exacerbate element diffusion and volatilization. By adopting a segmented heating process, the heating rate is reduced in the critical temperature range, allowing sufficient time for the components in the slurry to react and evaporate uniformly, avoiding the diffusion and volatilization of large amounts of elements caused by local overheating. For example, in the volatile temperature range of 500-800 ℃, reducing the heating rate from the conventional 10 ℃/min to 5 ℃/min effectively reduces the production of volatile compounds.
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Furnace atmosphere control: Optimizing the furnace atmosphere can promote the discharge of volatile substances and reduce re deposition. The company uses an oxygen rich atmosphere and increases the gas flow rate during the co firing process to accelerate the oxidation and discharge of volatile substances. At the same time, the reasonable design of the gas flow direction inside the furnace avoids the local accumulation of volatile substances in the furnace, reducing the possibility of them re depositing on the surface of the ceramic layer.
（3） Use barrier layer
Advanced Institute (Shenzhen) Technology Co., Ltd. also proposed a method of introducing a barrier layer between the platinum electrode and the ceramic layer. The barrier layer material is selected from substances with high chemical stability and low diffusion coefficient, such as oxide films with specific compositions. Before multi-layer co firing, a barrier layer is prepared on the surface of the ceramic layer through processes such as sputtering and coating. The barrier layer can effectively block
Platinum electrode slurryThe diffusion of intermediate elements does not affect the bonding performance between the electrode and the ceramic layer. Experiments have shown that the use of barrier layers greatly improves interlayer contamination issues and significantly increases product yield.
Advanced Institute (Shenzhen) Technology Co., Ltd. has successfully solved the interlayer pollution problem of co fired platinum electrode slurry in the multi-layer co firing process by optimizing the slurry formula, improving process control, and introducing barrier layers, providing reliable technical support for electronic component manufacturing enterprises and promoting the further development and application of multi-layer co firing technology.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.
