How to improve the sintering activity of pressureless sintered nano copper paste?

With the rapid development of the electronics industry, there is an increasing demand for high-performance, low-cost, and environmentally friendly interconnect materials.Pressureless sintering of nano copper pasteAs a new type of interconnect material, it has attracted widespread attention due to its excellent conductivity, thermal conductivity, and processability. However, how to improve the sintering activity of pressureless sintered nano copper paste to achieve more efficient sintering process and superior interconnect performance is an important direction of current research. This article will explore several effective methods to improve the sintering activity of pressureless sintered nano copper paste, based on the YB5108 pressureless sintered nano copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd.

1、 Optimize raw material selection

1.1 High purity nano copper powder

The key to improving sintering activity is to select high-purity and uniformly sized nano copper powder. High purity copper powder can reduce the influence of impurities on the sintering process, while nanoscale particle size can significantly increase the specific surface area of copper particles, improve their surface activity, and promote the diffusion and binding of copper particles during the sintering process.

1.2 Suitable additives

Adding an appropriate amount of sintering aids or stabilizers, such as silicon nitride, silicon carbide, etc., can effectively improve the sintering performance of copper paste. These additives can lower the sintering temperature, increase the sintering speed, while maintaining good conductivity and mechanical properties of the material.

2、 Improve the preparation process

2.1 Uniform dispersion

Advanced mixing equipment and technologies such as ultrasonic treatment and ball mills are used to ensure the uniform dispersion of components such as nano copper powder, binders, solvents, and additives in the slurry. A uniformly dispersed slurry is beneficial for improving the uniform distribution and densification of copper particles during the sintering process, thereby enhancing sintering activity.

2.2 Fine filtration and defoaming

Remove impurities and particles from the slurry through a fine filtration process, and use vacuum defoaming technology to remove bubbles from the slurry. This not only improves the purity and density of the slurry, but also facilitates the tight arrangement and bonding of copper particles during the sintering process, thereby enhancing sintering activity.

2.3 Preparation characteristics of YB5108 pressureless sintered nano copper paste from Yanbo brand

Yanbo brand YB5108 pressureless sintered nano copper pasteBy adopting advanced preparation technology and finely controlling the particle size distribution of nano copper powder and adding appropriate sintering aids, high uniformity and stability of the slurry have been achieved. At the same time, the copper paste also has good fluidity and coatability, making it easy to apply in fields such as microelectronic packaging and flexible electronics.

3、 Optimize sintering conditions

3.1 Precise control of sintering temperature

Sintering temperature is one of the key factors affecting sintering activity. Excessive temperature may lead to excessive oxidation or volatilization of copper particles, while insufficient temperature may result in incomplete sintering. Therefore, it is necessary to precisely control the sintering temperature according to the composition and performance requirements of the copper paste to achieve the best sintering effect.

3.2 Reasonable control of sintering time

The length of sintering time also directly affects sintering activity. A too short sintering time may lead to incomplete sintering, while a too long time may cause excessive sintering or thermal decomposition. Therefore, it is necessary to control the sintering time reasonably according to the sintering characteristics and equipment conditions of the copper paste in order to achieve the desired sintering effect.

3.3 Atmosphere control

During the sintering process, selecting suitable atmosphere conditions, such as inert atmosphere or reducing atmosphere, can protect copper particles from oxidation and improve sintering quality and efficiency.Yanbo brand YB5108 pressureless sintered nano copper pasteThe use of nitrogen atmosphere protection during the sintering process effectively prevents the oxidation of copper particles and improves sintering activity.

4、 Application of new sintering technology

With the development of technology, new sintering techniques continue to emerge, providing new ways to improve the sintering activity of pressureless sintered nano copper paste. For example, new sintering technologies such as microwave sintering and flash sintering can achieve high-temperature sintering in a short period of time, significantly improving sintering speed and activity.

5、 Summary

increasePressureless sintering of nano copper pasteThe sintering activity needs to be approached from multiple aspects such as raw material selection, preparation process, sintering conditions, etc. By optimizing raw material selection, improving preparation processes, optimizing sintering conditions, and applying new sintering technologies, the sintering activity of pressureless sintered nano copper paste can be effectively improved, providing strong support for its application in microelectronics packaging, flexible electronics, and other fields. The YB5108 pressureless sintered nano copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. is a successful practice of these optimization measures, demonstrating excellent sintering performance and broad application prospects.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.