In the manufacturing of electronic components, when using PI gold-plated films, how can we prevent them from interfering with the performance of the components?

With the rapid development of electronic technology, the trend of miniaturization and multi-functionality of electronic components is becoming increasingly evident. Against this backdrop, polyimide (PI) materials have been widely used in the manufacturing of electronic components due to their excellent heat resistance, mechanical strength and electrical insulation. Especially in applications that require high reliability and stability, the use of PI gold-plated films has become increasingly common. However, in practical applications, gold-plated films may have certain impacts on the performance of electronic components. This article will explore how to effectively avoid these interferences and introduce the efforts and achievements made by Advanced Institute (Shenzhen) Technology Co., Ltd. in this regard. 

The function of PI gold-plated film

PI gold-plated film is typically used to provide good electrical conductivity, oxidation resistance and corrosion resistance, while also enhancing the reliability of solder joints. It is widely applied in fields such as microelectronic packaging, connectors and printed circuit boards (PCBs). 

Sources of Interference and Preventive Measures

1. Optimization of Surface Treatment Process

To ensure a uniform and defect-free gold plating layer, it is essential to strictly control the surface pretreatment process. This includes cleaning, activation, and electroless nickel plating steps. Any residual contaminants can lead to discontinuous or uneven plating thickness, thereby affecting the performance of the final product. Advanced Institute (Shenzhen) Technology Co., Ltd. has introduced advanced cleaning technologies and precise chemical treatment processes to ensure that the substrate surface is in a better state, reducing potential problems caused by poor plating quality.  

2. Avoiding Stress Concentration

Internal stresses generated during the deposition process, if not properly managed, may lead to cracking or delamination of the gold film, thereby affecting the quality of electrical connections. Therefore, potential stress sources should be considered during the design stage and corresponding countermeasures taken. For instance, selecting appropriate PI substrate materials, adjusting the thickness distribution of the coating layer, and using flexible buffer layers to alleviate stress accumulation. Advanced Institute (Shenzhen) Technology Co., Ltd., with its profound technical accumulation, has developed a complete solution that can effectively reduce stress risks and improve the yield rate. 

3. Precise Control of Coating Thickness

Both overly thick and overly thin gold coatings can have negative impacts on the product. The former increases costs and may lead to signal delay; the latter fails to meet the reliability requirements for long-term use. To address this, the company has adopted high-precision measuring instruments to monitor the entire electroplating process in real time, ensuring that each layer of metal reaches the ideal thickness range. Additionally, strict inspection standards have been established, and sampling tests are conducted on each batch of products to guarantee the stability of the products leaving the factory. 

4. Environmental Factors Consideration

External environmental factors such as temperature changes and humidity levels can also affect the performance of PI gold-plated films. In high-temperature environments, gold atoms tend to diffuse into the interior of the PI substrate, altering its physical properties; under humid conditions, there is a risk of oxidation. To address these issues, Advanced Institute (Shenzhen) Technology Co., Ltd. has developed a series of protective coatings that can provide additional protection for electronic components without compromising their original functions, thereby extending their service life. 

Conclusion

In summary, the correct application of PI gold-plated film in the manufacturing of electronic components not only helps to enhance product quality but also holds significant importance for the advancement of the industry. As a leading player in the field, Advanced Institute (Shenzhen) Technology Co., Ltd. is committed to technological innovation and service optimization, constantly exploring more efficient production processes and technical means to bring more value to customers. In the future, with the continuous emergence of new materials and new processes, it is believed that more and better methods will be developed, making the application of PI gold-plated film more extensive, safe and reliable.

The above data is for reference only. Specific performance may vary depending on the production process and product specifications.