How to avoid the generation of tin slag during the PI tin plating manufacturing process?

PI (polyimide) tin plated filmAs an important electronic material, it has been widely used in fields such as electronics, communication, aerospace, etc. due to its excellent electrical insulation, heat resistance, and mechanical strength. However, the generation of tin slag has always been an important problem that troubles production enterprises in the manufacturing process of PI tin plated film. Tin slag not only affects the quality and performance of products, but also increases production costs. This article will explore how to avoid the generation of tin slag in the PI tin plating manufacturing process, and introduce the relevant research results and practical experience of Advanced Institute (Shenzhen) Technology Co., Ltd.

1. Optimize electroplating process parameters

Control current density: Ensure uniform distribution of current density and avoid rapid tin deposition caused by excessive local current density, resulting in the formation of tin slag. This can be achieved through the rational design of electrode and plating tank structures.

Adjust the composition of the plating solution: Maintain an appropriate ratio of tin ion concentration, additives, and other components in the plating solution to avoid component imbalance that can lead to tin slag production. Regular testing and adjustment of plating solution composition are key.

Control electroplating time and temperature: Excessive electroplating time and temperature may accelerate the oxidation and uneven deposition of tin, thereby increasing the generation of tin slag. Therefore, the electroplating time and temperature should be set reasonably according to the specific situation.

2. Use high-quality electroplating materials and equipment

Selecting high-purity tin materials: High purity tin materials contain fewer impurities, which helps reduce the generation of tin slag.

Regular maintenance of electroplating equipment: Ensure the cleanliness and integrity of electroplating tanks, electrodes, and other equipment to avoid tin slag problems caused by equipment aging or improper maintenance.

3. Add antioxidants

Adding an appropriate amount of antioxidant to the electroplating solution can effectively reduce the oxidation and burning loss of tin, thereby reducing the generation of tin slag. The selection and dosage of antioxidants should be optimized according to specific circumstances.Advanced Institute (Shenzhen) Technology Co., LtdThe high-efficiency tin solution antioxidant additive developed is composed of various metal elements such as tin, zirconium, phosphorus, hafnium, etc., which can significantly improve the surface structure and corrosion resistance of the coating, while reducing the generation of tin slag.

4. Strengthen pre-processing and post-processing steps

Thoroughly clean the surface of the substrate: Prior to electroplating, the surface of the PI substrate should be thoroughly cleaned to remove impurities such as oxides and grease, ensuring good adhesion between the tin layer and the substrate.

Thorough rinsing after tin plating: After tin plating is completed, sufficient cold and hot water rinsing should be carried out to remove residual impurities and oxides, and slow down the oxidation rate of the tin layer.

5. Improve equipment design and operational processes

Reduce the contact area between the tin solution and air: By increasing the flow guide device and anti oxidation sleeve, the exposed area of the tin solution during the electroplating process can be reduced, thereby reducing the amount of oxidation.

Reasonably arrange the flow of liquid tin: In processes such as wave soldering, arranging the flow height and speed of liquid tin reasonably, reducing the contact time with air, can help reduce the generation of tin slag.

6. Training and Operating Standards

Training operators: Improve the skills and awareness of operators, ensure that they are familiar with electroplating process parameters and operating procedures, and can correctly execute various operating specifications.

Develop and implement strict operating procedures: clarify the operational requirements and precautions during the electroplating process, ensuring that each step is executed according to standards.

Practice of Advanced Institute (Shenzhen) Technology Co., Ltd

Advanced Institute (Shenzhen) Technology Co., LtdPI tin plated filmAccumulated rich experience in the manufacturing process. The company has developed a comprehensive solution to avoid the generation of tin slag through continuous technological innovation and practical exploration. For example, the company has significantly reduced the generation rate of tin slag and improved the quality and performance of PI tin plating film by optimizing electroplating process parameters, using high-quality electroplating materials and equipment, and adding self-developed antioxidants.

conclusion

To avoid the generation of tin slag during the manufacturing process of PI tin plated film, multiple aspects need to be taken into account, including optimizing electroplating process parameters, using high-quality electroplating materials and equipment, adding antioxidants, strengthening pre-treatment and post-treatment steps, improving equipment design and operating procedures, as well as training and operating standards. By comprehensively applying these measures and combining them with the practical experience and technical support of enterprises such as Advanced Institute (Shenzhen) Technology Co., Ltd., the generation rate of tin slag can be significantly reduced, the quality and performance of PI tin plated film can be improved, and strong guarantees can be provided for the development of related industries.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.