Gold conductor paste (low temperature)

Gold conductor paste is a material used in microelectronics and precision electronic component manufacturing, mainly composed of gold powder, adhesive, and solvent. After solidification or sintering at low temperatures, this slurry can form a thin film or connection point with good conductivity. Low temperature gold conductor paste is particularly suitable for sensitive electronic components that cannot withstand high temperature processing.

Product Features

Low temperature sintering: Compared with traditional high-temperature sintering gold paste, low-temperature gold conductor paste can achieve good sintering effect at lower temperatures, which helps reduce the damage of thermal stress to electronic components and improve production efficiency.

High conductivity: Gold, as a conductive phase, endows the paste with excellent conductivity, which can meet the requirements of high-precision and high-density circuit wiring.

Good adhesion: Low temperature gold conductor paste has good adhesion with various substrates (such as ceramics, glass, metals, etc.), which can ensure the stability and reliability of the circuit.

Thin line resolution: Suitable for making thin line circuits, it helps improve the integration and performance of the circuit.

Preparation method

Mixing raw materials: Mix the prepared gold powder evenly with an appropriate amount of filler (such as glass powder, used to enhance adhesion and sintering performance), resin (as a binder), and solvent (used to adjust the fluidity and viscosity of the slurry).

Ball milling or grinding: The mixed raw materials are subjected to ball milling or grinding treatment to further refine the particles and ensure uniform dispersion between each component.

Adjust viscosity: Adjust the viscosity of the slurry by adding an appropriate amount of solvent or thickener to meet the requirements of the coating process.

Coating: The prepared gold conductor paste is coated onto the substrate of electronic components or integrated circuits through methods such as screen printing, spraying, or spin coating.

Drying: Place the coated substrate in a dry environment to evaporate the solvent in the slurry, forming a dry conductive film layer.

Low temperature sintering: Sintering the substrate at a lower temperature (usually lower than the sintering temperature of traditional gold paste). During this process, the resin will burn off, and the gold powder particles will fuse with each other to form a continuous conductive network. Low temperature sintering helps to reduce the damage of thermal stress to electronic components and improve production efficiency.

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