Gold conductor paste

Gold conductor paste is a material widely used in the microelectronics and semiconductor industries, mainly for forming conductive paths or electrodes. It is composed of gold powder, binder (usually glass phase or inorganic binder), organic carrier, and other additives.

Product Features

Excellent conductivity: Gold conductor paste has excellent conductivity and can provide stable current transmission capability.

Good adhesion: The slurry can firmly bond with the substrate, preventing the wire from falling off.

High temperature resistance: The performance of gold conductor paste remains stable in high temperature environments, making it suitable for electronic components working in high-temperature environments.

Fine line resolution: Gold conductor paste has excellent fine line resolution, suitable for producing high-precision, high-density electronic components.

Application scope

Multi layer wiring conductor: used to make multi-layer wiring conductors to achieve high reliability and high density thick film integrated circuits.

Gas sensitive components: can be used to make gas sensitive components, improve the sensitivity and response speed of the components.

Microwave hybrid integrated circuit: It has good conductivity and fine line resolution in microwave hybrid integrated circuits, and is suitable for the production of high-frequency circuits.

High power transistor chips and lead frames: used to manufacture high-power transistor chips and lead frames, improving the reliability and high temperature resistance of the chips.

Workshop Display