Inner layer gold conductor paste

Inner layer gold conductor paste refers to the gold conductor paste used inside multi-layer ceramic substrates or multi-layer printed circuit boards (PCBs). This slurry is mainly used to form internal conductive layers, such as in multi-layer ceramic substrates such as low-temperature co fired ceramics (LTCC) or high-temperature co fired ceramics (HTCC), as the material for the internal conductive layer.

Product Features

Excellent conductivity: The inner layer gold conductor paste has excellent conductivity with low resistivity, ensuring the stability and excellent conductivity of the circuit.

Good adhesion performance: The slurry can firmly bond with the PCB substrate, prevent wire detachment, and improve product reliability.

Corrosion resistance: It can resist chemical corrosion during the PCB manufacturing process, ensuring that the quality and performance of the wires are not affected.

Molding performance: It has good molding performance, making it easy to form flat and uniform wires through printing, drying, and curing processes during PCB manufacturing.

Brightness: The brightness of gold powder helps improve the appearance quality and optical performance of PCBs.

Preparation method

Formula: The inner layer gold conductor paste is usually composed of gold powder, glass phase (if any), organic carrier, and other additives.

Printing: Coating the slurry onto a ceramic substrate using techniques such as screen printing or inkjet printing.

Sintering: Sintering is carried out at an appropriate temperature to evaporate organic components and fuse gold particles to form a conductor layer.

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