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Surface bonding alloy slurry
  • Surface bonding alloy slurry
  • Surface bonding alloy slurry
  • Surface bonding alloy slurry
  • Surface bonding alloy slurry
  • Surface bonding alloy slurry

Surface bonding alloy slurry

Advanced Institute Technology's surface bonding alloy slurry is specialized for conductive connection and repair in industries such as electronics and communication, with high conductivity, strong adhesion, and corrosion resistance. Suitable for various scenarios such as integrated circuit packaging, chip connection, circuit board repair, etc., it is your ideal choice for achieving efficient conductive connections.Come to our information center to learn moreTechnical data of gold paste

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Surface bonding alloy slurry is a special material designed specifically for the electronics industry, mainly used for manufacturing low-temperature co fired ceramic (LTCC) substrates, thick film circuits, interconnects of integrated circuit (IC) chips, and other high-performance electronic components. The characteristic of this slurry is that it can bond under specific conditions after solidification, thereby forming a reliable electrical connection.
表面可键合金浆料

Product Features

High adhesion: The surface bonding alloy slurry has strong adhesion, which can firmly connect different materials or components together, ensuring the stability and reliability of the connection.

High temperature resistance: Some surface bonding alloy slurries can maintain stable performance in high temperature environments, suitable for bonding requirements under high temperature conditions, and improve the product's range of use.

Corrosion resistance: Some surface bonding alloy slurries have good corrosion resistance and can maintain stability in harsh environments such as acid and alkali, extending the service life of the product.

Fast curing time: Surface bonding alloy slurries usually have a short curing time, which can quickly complete bonding operations and improve production efficiency.

表面可键合金浆料
Application scope

Electronics industry: Surface bonding alloy paste is commonly used in semiconductor chip packaging, PCB board assembly and other processes to ensure the reliability and stability of electronic devices.

Automotive industry: In the automotive industry, surface bonding alloy slurry can be used for body repair, component bonding, etc. It has good high temperature resistance and weather resistance, meeting the high requirements of the automotive industry for material performance.

Medical industry: Surface bonding alloy slurries are also used in the medical field, such as in the assembly and repair of medical devices, to meet the requirements of corrosion resistance and biocompatibility of medical devices.

Mechanical manufacturing industry: In the mechanical manufacturing industry, surface bonding alloy slurry can be used for bonding, repairing, etc. of metal parts, improving the service life and performance of mechanical equipment.

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表面可键合金浆料参数表面可键合金浆料参数
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