PI plating high -pure lead (PB)

Advanced Academy of Technology PI Magnetic Splane Plating high -pure lead (PB) is a common coating process to improve the conductivity, erosion resistance and abrasion resistance on the surface of the material.

1. Principles of PI magnetic sputtering coating: PI (PlanarMagnetronsPuttering) magnetic control sputtering is a physical gas deposition technology. By placing metal target materials (such as high -pure lead) in the vacuum environment, , Use high -energy particle beam to bombard the target material, so that the atoms or molecules on the surface are left and deposited on the surface of the plating to form a uniform and dense coating.

2. The advantages of high -pure lead (PB): High -purity lead is a material with excellent conductivity, corrosion resistance and abrasion resistance. Through the PI magnetic sputtering layer, a dense and uniform lead -plated layer can be formed on the surface of the material, which improves the electrical and erosive resistance of the material, and makes it better resistance to the electromagnetic interference and erosion of the external environment.

3. Application of Pi magnetic control sputtering coating: Pi magnetic control sputtering high -pure lead is mainly used in the fields of electronic components, conductive materials, and anti -corrosion coating. For example, in electronic components, the use of high -purity lead plating can improve the stability of contact resistance and signal transmission; in the conductive material, high -purity lead plating can improve the conductive performance of the material; The coating can increase the corrosion resistance of the material.

Therefore, PI magnetic sputtering high -pure lead is an effective surface treatment technology, which has the advantages of improving the conductivity, corrosion resistance and abrasion resistance of the material. It is suitable for electronic components, conductive materials and anti -corrosion coating, etc. field.