YB-1099 patch copper paste

Advanced Institute of TechnologyYB-1099 patch copper pasteIt is a product with excellent conductivity, thermal conductivity, and adhesion, which can be used for packaging power chips or as a substitute for solder paste. Due to its excellent rheological properties, we can produce high-precision solder pads through solidification machines or steel mesh printing machines. In addition, special resin systems can also provide high adhesion reliability. This type of patch copper paste has the characteristics of high thermal conductivity, high electrical conductivity, and high thixotropy, making the dispensing operation very suitable for various situations.

Product features:

The rheological properties of low viscosity, high thixotropy, and no drawing are very suitable for high-speed solidification.

Can be effectively applied in the fields of power integrated circuits and transistors.

Has high adhesion on different substrates.

• Has excellent conductivity.

Based on the specific process requirements of the customer, we can provide comprehensive differentiated customization.

Technical parameters:

Test method for specification values of project units

Appearance - Yellow gray visual inspection

liquid state

Viscosity (25 ℃) Pa · s100 ± 30 Brookfield E type 0.5min-1

Thixotropic coefficient (25 ℃) -6 ± 1.5 Brookfield E type 0.5/5.0min-1

solid state

Solid content%>920 ℃ × 2hr

Elastic modulus GPa16DMA

Glass transition temperature ℃ 155DMA

Expansion coefficient ppm/℃ 40TMA

Thermal conductivity coefficient W/m · k25LaserFlash

Volume resistivity Ω· cm5 × 10-5 low resistance tester

Shear strength 25 ℃ kgf3kgf1 * 1mm chip Ag/CuNK-1 thrust meter

260℃kgf1.5kgf}

In your microelectronics manufacturing and packaging process,Surface mounted copper pasteIt will be a very valuable choice. Not only can it meet the demand for high-speed solidification, but it can also play an outstanding role in the fields of power integrated circuits and transistors. Our product has extremely high adhesion and is suitable for a variety of substrates. In addition, we can also provide comprehensive customization according to your specific requirements to fully meet your process needs. Let's explore and create even more exquisite technology together!