Research on the Main Components and Optimal Proportions of Platinum Conductor Slurry

brief introduction

Platinum conductor paste has a wide range of applications in high-tech fields such as semiconductors, sensors, and fuel cells due to its excellent conductivity, corrosion resistance, and high-temperature stability. This article explores the main components and optimal ratio of platinum conductor slurry, and verifies the influence of ratio on the properties of the slurry through experiments.

Platinum conductor paste is a special material used to make conductive lines, usually composed of platinum powder, organic carriers, and other additives. Platinum powder provides the necessary conductivity, while organic carriers and additives affect the rheological properties of the slurry and the final sintering quality. Reasonably adjusting the proportion of these components is crucial for optimizing the performance of the slurry. This article will be based on the information provided by Advanced Institute (Shenzhen) Technology Co., LtdResearch on YB8206 Platinum Conductor SlurryConduct experimental analysis.

Experimental Materials and Methods

The slurry sample used in this study isResearch Platinum YB8206Its main components include:

• Platinum powder: as a conductive material;
• Organic carrier: including solvents, binders, etc., used to ensure the fluidity of the slurry during the printing process and the stability after sintering;
• Additives: such as dispersants, leveling agents, etc., used to improve the processing performance of pulp.

The experimental methods mainly include:

1. Slurry preparation: Prepare a series of slurry samples according to different proportioning schemes;
2. Sintering process: coating the slurry onto the substrate and processing it according to the predetermined sintering curve;
3. Performance testing: Test the key performance indicators such as electrical resistivity and adhesion of the sample, and record the data.

Experimental results and analysis

In order to explore the influence of different ratios on the properties of the slurry, this study designed three different ratio schemes:

• Plan A: Platinum powder content is 80%, organic carrier content is 15%, and additive content is 5%;
• Option B: The platinum powder content is 82%, the organic carrier content is 14%, and the additive content is 4%;
• Option C: The platinum powder content is 85%, the organic carrier content is 12%, and the additive content is 3%.

Through experimental data comparison, it was found that scheme C exhibited the lowest resistivity value of 1.9 Ω· cm, while scheme A had a resistivity of 2.3 Ω· cm and scheme B had a resistivity of 2.1 Ω· cm. This indicates that withPlatinum powderAs the content increases, the resistivity of the slurry shows a decreasing trend.

In the adhesion test, scheme C also showed the best performance, with an adhesion of 1.6 N/mm ², compared to scheme A with an adhesion of 1.2 N/mm ² and scheme B with an adhesion of 1.4 N/mm ². This means that a higher platinum powder content helps to enhance the bonding strength between the slurry and the substrate.

In addition, scanning electron microscopy (SEM) images showed that as the platinum powder content increased, the surface of the sintered slurry became denser and smoother. The sample surface of scheme C has almost no obvious cracks or holes, while schemes A and B have varying degrees of defects.

discuss

The experimental results show that increasing the content of platinum powder appropriately can effectively reduce the resistivity of the slurry and enhance its adhesion. This is because more platinum powder helps to form a continuous conductive network and reduce resistance; Meanwhile, an appropriate amount of organic carriers and additives ensure the fluidity of the slurry and the stability after sintering. However, the increase in platinum powder also means an increase in cost, so it is necessary to find a balance between performance and economy.

conclusion

By comparing the experimental results under different proportioning schemes, we conclude that, while ensuring good performance of the slurry, increasing the platinum powder content to 85% and reducing the amount of organic carriers and additives to 12% and 3% can result in lower resistivity and stronger adhesionPlatinum conductor pasteThis ratio scheme is suitable for application scenarios that require high-performance conductor materials. Future research will focus on exploring how to further optimize formulations to meet more complex application needs.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.