Through hole gold paste can be divided into various types, such as silver paste, nickel paste, copper paste, carbon paste, and winding paste

Through-hole gold pasteIt is a special material used in the manufacturing of electronic products, which can provide excellent conductivity and corrosion resistance, and is widely used in the manufacturing process of printed circuit boards (PCBs). In the following article, we will provide a comprehensive introduction to through-hole gold paste, including its definition, classification, characteristics, applications, production processes, and market prospects.
1、 Definition and Classification
Through hole gold paste, also known asPressure-sensitive conductive adhesiveIt is a highly conductive adhesive that can be directly applied to the surface of PCB or other electronic components to create through holes and achieve conductive connections between different layers. Normally, through-hole gold paste is coated on the inner and outer surfaces of the PCB board to form a uniform conductive layer, ensuring the stability and reliability of signal transmission, and preventing corrosion of the metal layer on the PCB board.
According to its chemical composition, application field, and production process, through-hole gold paste can be divided into various types, such asSilver pasteNickel paste, copper paste, carbon paste, winding paste, etc.

2、 Characteristics
The through-hole gold paste has the following characteristics:
Excellent conductivity: The main function of through-hole gold paste is to achieve conductive connections between different layers, so its conductivity must be guaranteed. Compared with traditional PCB manufacturing materials, through-hole gold paste has better conductivity and stability.
Strong corrosion resistance: In complex industrial environments, the metal layer of PCB boards is easily affected by factors such as oxidation and corrosion, leading to signal transmission distortion or component damage. The through-hole gold paste has good corrosion resistance and can effectively prevent corrosion of the metal layer.
Strong adhesion: The through-hole gold paste can firmly adhere to the surface of the PCB board, forming a uniform conductive layer, thereby achieving good signal transmission effect.
Simple production process: Compared to other PCB manufacturing materials, the production process of through-hole gold paste is simpler and does not require multiple steps such as electroplating, which can greatly improve production efficiency.

Through hole gold paste is widely used in the manufacturing process of various electronic products, such as mobile phones, tablets, computers, smart homes, etc. With the continuous popularization and upgrading of electronic products, the demand for through-hole gold paste is also increasing.
In mobile devices such as smartphones and tablets, through-hole gold paste is mainly used to achieve conductive connections between various layers of PCB boards, ensuring the stability and reliability of signal transmission, and preventing oxidation and corrosion of metal layers.
In fields such as computers and smart homes, through-hole gold paste is also widely used, for example, it can be used to achieve interconnection between motherboards and graphics cards, ensuring efficient and accurate data transmission. In addition, in the development of emerging fields such as artificial intelligence, the Internet of Things, and intelligent manufacturing, the application prospects of through-hole gold paste are very broad.
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