Application of Carbon nanotube Graphene Absorbing Materials

Carbon nanotubesCombining the structure and thermal conductivity of carbon nanotubes, the potential application directions of carbon nanotubes in thermal management technology mainly include:

(1) Using carbon nanotubes as additives to improve the heat transfer network structure within various polymer matrices, thereby developing high-performance thermal conductive resins, electronic fillers, or adhesives;
(2) Construct a self-supporting carbon nanotube film structure and achieve heat transfer in different directions by modulating the orientation distribution of carbon nanotubes;

(3) Developing a vertical array structure of carbon nanotubes, which achieves heat transfer along the axial direction of high thermal conductivity of carbon nanotubes through inter tube filling and composite at both ends, in order to provide an effective channel for heat transport between two interfaces and develop high-performance [3].

The most common is based onCarbon nanotube TIMsIt is mainly divided into three categories, arranged in order of manufacturing complexity as follows: carbon nanotubes and uniform mixing of carbon nanotubes and metal particles in polymer matrices, vertical arrangement and growth of carbon nanotubes on substrates, and double-sided arrangement and growth between chips and thermal distributors.

In carbon nanotube TIMs, the anisotropic structural and physical properties of carbon nanotubes, as well as the issue of excessive thermal resistance at the interface with other materials, are the key research directions that researchers need to focus on. The total thermal resistance of electronic devices usually includes the thermal dissipation of the device itself to the environment and the contact thermal resistance between TIMs. The increase in power loss is a trend that will require higher performance, lowest thermal resistance, and long-term reliabilityThermal interface material.

GrapheneGraphene thermal interface materialMainly using graphene or graphene combined with carbon nanotubes, metals, etc. as thermal conductive fillers, the material matrix is mainly epoxy resin (thermal conductive adhesive) as the main research direction, and other matrices such as silicone oil, mineral oil, silicone rubber, polyacrylate, polyethylene, polyurethane, etc.

Graphene, as a thermal conductive filler, mainly includes graphene sheets, exfoliated expanded graphene layers, single-layer and multi-layer graphene, single-walled carbon nanotubes and graphene, multi walled carbon nanotubes and graphene, biphenyl functionalized graphene, graphene and silver particles, and graphene oxide. Single layer or few layer graphene can also be used for heat dissipation in high-power electronic devices, such as transferring graphene prepared by chemical vapor deposition (CVD) method onto high-power chips.

The heat dissipation effect depends on the size and number of layers of graphene sheets, and impurities or wrinkles and cracks are easily introduced during the transfer process, which can also affect the heat dissipation effect of graphene. Improving the quality of graphene prepared by CVD method and optimizing the transfer method to reduce damage during the transfer process, or directly growing graphene on the surface of power chips, are the main methods to enhance the heat dissipation effect of graphene.

Preparing graphene into macroscopic thin films for thermal management is also an important approach. The main methods include: stripping graphene from liquid phase and forming the film through spin coating, droplet coating, dip coating, spray coating, and electrospinning; Transforming graphene oxide into a film through high-temperature reduction or chemical reduction;

Composite graphene and carbon fiber into a film; Alternatively, graphene thin films can be prepared into three-dimensional shapes for film formation. Graphene needs to be in contact with the device substrate, so reducing the contact thermal resistance between graphene film and substrate is a necessary consideration for graphene thermal management applications, such as using covalent bonds, functionalized molecules, and other methods.

Graphene film has advantages in performance and price to replace the current mainstream graphene film (PI) heat sink, which is a great challenge for the industrialization of graphene film.

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