Principle of High Purity Nickel Ni Coating on PI/PET Thin Films by Magnetron Sputtering

Magnetron sputtering technology has important applications in the field of thin film coating, among which PI/PET thin film magnetron sputtering coating high-purity nickel Ni technology is a common preparation methodMetal nickel thin filmThe method. This article will introduce the principle and application of magnetron sputtering deposition of high-purity nickel Ni on PI/PET thin films.

Metal nickel thin film, as an important functional material, has a wide range of applications in the semiconductor and microelectronics industries. However, there are some issues with directly plating nickel metal on the substrate, such as high resistivity and poor contact between the metal and semiconductor. Therefore, researchers have proposed a method of using PI/PET thin film magnetron sputtering to deposit high-purity nickel Ni to solve these problems. Next, we will provide a detailed introduction to the principles and applications of this technology.

1. Principle of High Purity Nickel Ni Coating on PI/PET Thin Films by Magnetron Sputtering

Magnetron sputtering coating technology is a method of sputtering target materials onto substrate surfaces using an ion source in a vacuum environment. In the process of magnetron sputtering high-purity nickel Ni on PI/PET thin films, nickel is first placed as the target material in an ion source, and then the nickel ions in the ion source are accelerated by applying a magnetic field. Subsequently, these accelerated nickel ions will collide with the surface of the PI/PET film and form a high-purity nickel film.

2. Application of High Purity Nickel Ni Coating on PI/PET Thin Films by Magnetron Sputtering

Metal nickel thin films have a wide range of applications in the semiconductor and microelectronics industries, often used to make electrodes for MESFET devices. The nickel film prepared by PI/PET thin film magnetron sputtering with high-purity nickel Ni technology has good conductivity and corrosion resistance. Moreover, due to the formation of nickel silicon compounds between nickel thin films and substrate materials, the electrical resistivity of metal semiconductor contact can be effectively reduced, thereby improving the performance of the device. Therefore, the PI/PET thin film magnetron sputtering deposition of high-purity nickel Ni technology has broad application prospects in the semiconductor and microelectronics industries.

Summary: PI/PETThin film magnetron sputtering deposition of high-purity nickel NiTechnology is an important method for preparing nickel metal thin films. Through this technology, metal nickel thin films with good conductivity and corrosion resistance can be prepared, thereby improving the performance of the device. In the semiconductor and microelectronics industries, metal nickel thin films are commonly used to make electrodes for MESFET devices by forming nickel silicon compounds with substrate materials to reduce contact resistivity. Therefore, the PI/PET thin film magnetron sputtering deposition of high-purity nickel Ni technology has broad application prospects in this field.