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Gold (Au) is a precious metal with many excellent properties, including good conductivity and chemical stability. Due to these characteristics, Au thin films have a wide range of applications in various fields, such as semiconductors, microelectromechanical systems, and biosensing.Au thin filmIts low resistivity makes it an ideal material for devices such as leads and electrodes.
However, the difference in thermal expansion coefficient between Au thin film and substrate material may lead to the failure of the thin film. To solve this problem, transition layers are usually used to reduce differences. A common transition layer between Au thin film and substrate material is chromium (Cr) thin film.
Cr thin films have good stability and can effectively reduce the thermal expansion difference between Au thin films and substrates. In addition, Cr thin film can provide good adhesion, ensuring tight contact between Au thin film and substrate, thereby improving the performance of the device.
Cr/Au thin filmThe stability of heterostructures has a direct impact on the performance of devices. A stable heterostructure can resist the influence of external environmental factors, thereby extending the service life of the device. In addition, due to the chemical stability of Au thin films, they can maintain stable performance in various chemical environments, which is one of the important advantages of using Au thin films.
However, despite the many advantages of Cr/Au thin film heterostructures, there are still some challenges in the actual preparation process. Due to the high cost of Au thin films and strict requirements for process conditions, it is not easy to prepare high-quality Cr/Au thin film heterostructures. Therefore, magnetron sputtering technology has received widespread attention as an efficient and controllable preparation method.
Magnetron sputtering is a plasma based thin film preparation technique that can produce high-purity and uniform thin films under vacuum conditions. In the process of preparing Cr/Au thin films by magnetron sputtering, the Cr and Au targets need to be placed in the reaction chamber first. Then, the plasma is excited by heating the target material and applying a magnetic field. Using ions on the target material as the target, control the sputtering conditions to allow Cr and Au atoms to be sputtered onto the substrate surface, forming a Cr/Au thin film.
adoptApplied FilmThe prepared Cr/Au film has good uniformity and density, which can effectively reduce the stress and thermal expansion difference between the Au film and the substrate. This preparation method can not only obtain high-quality films, but also control the thickness and composition of the films to meet the needs of different applications.
In summary, Au thin film, as a material with good conductivity and chemical stability, has a wide range of applications in various fields. In order to solve the problem of thermal expansion difference between Au thin film and substrate material, Cr thin film is often used as a transition layer. The stability of Cr/Au thin film heterostructures has a significant impact on the performance of devices. The Cr/Au thin film prepared by magnetron sputtering technology has excellent uniformity and density, which can effectively solve the problem of thermal expansion differences and improve the performance and stability of the device. Magnetron sputtering technology provides an efficient and controllable method for preparing high-quality Cr/Au thin films.
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