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RTF(Reverse Treat Foil)Reverse electrolytic copper foilIt is a new preparation method that has many advantages compared to traditional EDA (Electro Position of Copper) processes. The preparation process of RTF reverse electrolytic copper foil is simple, with high production efficiency, and the resulting copper foil has good surface flatness, high dimensional accuracy, and good stress uniformity. Therefore, it has been widely used in semiconductor, high-end electronics, and communication fields.
The preparation of RTF reverse electrolytic copper foil mainly consists of the following steps: first, a layer of organic film is coated on the surface of ordinary copper foil, and then it is placed in an electrolytic cell for electrolytic treatment. Under the action of an external electric field, active ions are generated on the film, and copper ions are deposited on the film to form reverse electrolytic copper foil.
High flatness: Compared to traditional copper foil preparation methods,RTF Reverse Electrolytic Copper FoilThe obtained copper foil has a higher surface flatness, which is of great significance for the manufacturing of high-precision electronic devices.
High dimensional accuracy: RTF reverse electrolytic copper foil can control dimensions within a small tolerance range, and the produced copper foil has good specification stability, which is very important for some PCB boards and semiconductor devices that require multi-layer stacking.
Good stress uniformity: In the preparation process of RTF reverse electrolytic copper foil, due to the coating of organic thin film on its surface, the internal stress of the copper foil is evenly distributed, which improves the stability and reliability of the copper foil.
RTF reverse electrolytic copper foil is widely used in the electronics industry due to its many advantages:
PCB industry: RTF reverse electrolytic copper foil is widely used in the manufacturing of PCB boards, which can provide high-quality copper foil materials and meet the needs of different thicknesses and sizes.
Semiconductor industry: With the continuous development of microelectronics technology, the quality requirements for copper foil are also increasing. The copper foil obtained by RTF reverse electrolytic copper foil has high surface flatness and dimensional accuracy, and is therefore widely used in semiconductor chip manufacturing.
Communication industry: The demand for copper foil in communication equipment is also very high,RTF Reverse Electrolytic Copper FoilThe obtained copper foil not only has the characteristics of high quality and high reliability, but also has high production efficiency, which can meet the needs of the communication industry.
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