Exploring the advantages and performance test results of PI copper-clad laminates

Introduction:PI copper-clad laminateIt is a material with excellent performance and has a wide range of applications in the industrial field.Advanced Institute of TechnologyThis article will introduce the importance of PI copper-clad laminates and provide detailed results of their testing projects.

Ig value - glass transition temperature: PI copper-clad laminates have low-temperature processing capabilities, and their glass transition temperature (Ig value) is below 300 degrees Celsius. This means that under high temperature conditions, PI copper-clad laminates can still remain stable and will not experience expansion or softening.

Flame resistance: PI copper-clad laminates meet the requirements of VTM-0 level during testing. This means that PI copper-clad laminates have extremely strong high-temperature combustion resistance, and will not burn or spread fire even under high temperature conditions.

Tensile strength: The tensile strength of PI copper-clad laminates is greater than 250 megapascals (MPa), indicating that they have good mechanical strength and tensile properties. In the industrial field, ensuring this strength is crucial for protecting the integrity of equipment and components.

Elongation rate: The elongation rate of PI copper-clad laminates exceeds 45%, which means they can withstand significant deformation without breaking under stress. This extension performance enables PI copper-clad laminates to remain stable in high stress environments, effectively extending their service life.

Peel strength: The peel strength of PI copper-clad laminates is 1.2N/millimeter. This means that although the adhesive force between PI copper-clad laminates and other substances is not easily broken under stress, its stability under complex working conditions can be ensured.

CTEXY/Z - Coefficient of thermal expansion:PI copper-clad laminateThe coefficient of thermal expansion is between 0.28-0.30ppm/degree Celsius, indicating its stability in temperature changing environments. Even under conditions of significant temperature fluctuations, the size changes of PI copper-clad laminates are minimal and will not have a negative impact on the normal operation of equipment and components.

Surface resistance: PI copper-clad laminates have a surface resistance of up to 1014 ohms, which effectively prevents the accumulation and diffusion of static electricity. This electrostatic protection capability is crucial for the safety of electronic devices and can prevent damage and interference caused by static electricity.

Volume dielectric constant: The volume dielectric constant of PI copper-clad laminates is also as high as 1014 ohms, demonstrating their excellent electrical insulation performance. This insulation performance can effectively isolate the current of different components on the circuit board, ensuring the normal operation of the circuit.

Thermal conductivity: The thermal conductivity of PI copper-clad laminates is 1.2W/(m.k), indicating high thermal conductivity. This thermal conductivity can help dissipate heat quickly, prevent equipment from overheating, and provide stable performance in high-power and high-temperature applications.

Breakdown voltage: The breakdown voltage of PI copper-clad laminate is as high as 18.3KV/mm, with excellent electrical insulation performance. This means that PI copper-clad laminates are less susceptible to electric shock in high voltage environments, ensuring the safety of electronic devices and equipment.

PI copper-clad laminates have been widely used in many fields due to their excellent performance. Through a detailed analysis of the above testing items, we can clearly understand the advantages and characteristics of PI copper-clad laminates. Its high heat resistance, mechanical strength, electrical insulation performance, as well as tensile and peel resistance, make it an indispensable and important material in the manufacturing of electronic devices and equipment.

Given thatPI copper-clad laminateThe importance in the field of electronics requires us to further strengthen the detection and control of its quality to ensure the production of high-quality PI copper-clad laminates. Only in this way can we meet the growing demand for high-performance materials in the electronic product market and promote the continuous innovation and development of electronic technology.