In recent years, with the rapid development of electronic products, the requirements for electronic devices have also become increasingly high.Ultra fine 0.02mm tinned copper foilAs an important material in the field of electronics, it is receiving increasing attention. It not only has high strength, high conductivity, and excellent weldability, but also hides some amazing technological black technology. Advanced Institute Technology reveals the technical parameters behind the truly ultra-fine 0.02mm tinned copper foil.
1、 Weldable tin plating
The weldability of ultra-fine 0.02mm tin plated copper foil is one of its most important characteristics. use
Weldable tin platingUltra fine copper foil can effectively improve the reliability and efficiency of welding processes. During the welding process, this material has excellent adhesion, which not only ensures the stability of the solder joint, but also reduces the welding contact resistance. The tin content of the tin plating layer is between 65-92%, which can be flexibly adjusted according to the customer's welding process requirements to achieve the best welding effect.
2、 Non welding tin plating
In addition to weldable tin plating, ultra-fine 0.02mm tin plated copper foil also has the characteristic of non weldable tin plating. Under this process, the tin content of the tin plating layer reaches 100% pure tin, greatly improving the conductivity. In addition, non welded tin plated ultrafine copper foil also exhibits excellent performance in surface resistance. Its surface resistance can be maintained within the range of 0.1~0.15 Ω, ensuring the stability and reliability of electronic devices.
3、 Product width and thickness
The product width of ultra-fine 0.02mm tinned copper foil usually does not exceed 300mm, suitable for various small-sized electronic devices. Its product thickness ranges from 0.035mm to 0.15mm, and with its ultra-thin characteristics, it has been widely used in the field of electronics.
4、 Thickness of tin plating layer
The thickness of the tin plating layer is one of the important indicators for evaluating the quality of ultrafine 0.02mm tin plated copper foil. According to technical requirements, the thickness of the tin plating layer should not be less than 0.3 µ m and can be adjusted according to specific customer needs. This thickness can ensure the occurrence of delayed corrosion on the surface of tinned copper foil and extend its service life.
5、 Adhesion and substrate performance degradation
The adhesion and substrate performance degradation of ultrafine 0.02mm tin plated copper foil are also important factors to consider. Due to the high degree of fusion between its tin plating layer and copper substrate, the adhesion reaches 5B level, ensuring the stability of the tin plating layer. In addition, the performance degradation of the substrate after electroplating should be less than 10%. This means that during the electroplating process, there is only a slight decrease in the strength and elongation of the substrate, which can maintain the mechanical properties and processability of the material.
Advanced Institute of Technology Ultra fine 0.02mm
Tin plated copper foilAs an advanced material in the field of electronics, it has the characteristics of weldability and non weldability, and has excellent performance in product width, thickness, tin coating thickness, tin content of tin coating, adhesion, and substrate performance degradation. Its emergence has brought great convenience to the manufacturing and use of electronic devices, helping to promote the development of the electronics industry. Looking ahead to the future, we believe that ultra-fine 0.02mm tin plated copper foil will continue to inject continuous power into the sustained development of the electronics industry through its unique technology and breakthroughs.
