Tin within reach: The wonderful world of magnetron sputtering coated high-purity tin Sn

Tin is a metallic element with the characteristics of softness and flexibility, and is also a commonly used material. This article will explore the properties, applications, andMagnetron sputtering deposition of high-purity tinExplain the process and why magnetron sputtering is chosen as an effective method for tin plating.

1. Three isomers of tin

1.1 White Tin

White tin belongs to the tetragonal crystal system, with unit cell parameters: a=0.5832nm，c=0.3181nm。 Each unit cell contains 4 Sn atoms with a density of 7.28g/cm3. The hardness of white tin is relatively low, at 2, but it has good ductility.

1.2 Grey Tin

Gray tin belongs to the diamond shaped cubic crystal system, with unit cell parameters: a=0.6489nm。 Each unit cell contains 8 Sn atoms with a density of 5.75g/cm3. Gray tin is sparser compared to white tin, but it does not affect its application range.

1.3 Brittle Tin

Brittle tin belongs to the orthorhombic crystal system with a density of 6.54g/cm3. Despite its moderate density, the unique crystal cell structure of brittle tin makes it brittle under certain conditions.

2. Chemical properties of tin

Tin is relatively stable at room temperature and is not easily oxidized by oxygen, thus maintaining its silver luster. It is a non-toxic substance widely used in the manufacturing of containers for food and beverages. In addition, tin can form a protective film of tin dioxide in the air, making it more stable. Under heating conditions, the oxidation reaction will accelerate. In addition, tin can react with halogens and sulfur, and can dissolve in strongly alkaline solutions. However, it will corrode in acidic solutions of salts such as ferric chloride and zinc chloride.

3. Magnetron sputtering deposition of high-purity tin Sn

Magnetron sputtering is a commonly used coating technique that applies a magnetic field to evaporate and deposit metal materials on the surface of a substrate, thereby forming a uniform and dense thin film. During the tin plating process, magnetron sputtering can achieve uniform deposition of high-purity tin Sn.

The main steps of magnetron sputtering for high-purity tin plating include: pretreatment, selection of sputtering materials, optimization of sputtering conditions, analysis of film composition, etc. By selecting appropriate sputtering materials and optimizing sputtering conditions, high-purity tin films can be obtained.

High purity tin Sn has a wide range of applications, such as electronic components, solar cells, IC packaging, and other fields. Its advantages include ultra-low temperature linear expansion coefficient, excellent electrical conductivity, and good corrosion resistance.

Summary:

Tin, as a metallic element, has the characteristics of softness and flexibility, with a melting point of 231.89 ℃ and a boiling point of 2260 ℃. It exists in three allotropes, including white tin, gray tin, and brittle tin, each with different crystal cell structures and densities. Tin has relatively stable chemical properties and is not easily oxidized by oxygen, but it is susceptible to corrosion by halogens and certain solutions. Magnetron sputtering is a commonly used coating technique that can be used to deposit high-purity coatingsTin filmIt has a wide range of applications and excellent performance. By selecting appropriate materials and optimizing conditions, we can further improve the quality of tin thin films.