200 kHz high-frequency flexible copper-clad laminate special LCP film gold and silver plating

Uniform material properties, stable electrical properties, and minimal fluctuations

High heat resistance during welding

Compared with PI film, it has lower dielectric constant and dielectric loss factor

Compared with PI membrane, it has lower water absorption rate and water vapor transmission rate

Stable electrical performance and good dimensional stability in high humidity environments

It can be directly hot pressed and laminated with copper foil and other materials, making it easy to drill holes, resistant to bending, and has excellent processability

High frequency flexible copper-clad laminateIt is a material used in the manufacturing of high-frequency circuit boards, usually composed of copper foil, resin, and glass fiber. It has the following characteristics:

1. High frequency performance: Due to its special structure and material composition, high-frequency flexible copper-clad laminates can withstand electromagnetic interference and losses during high-frequency signal transmission, ensuring high reliability and stability of the circuit.

2. Flexibility: High frequency flexible copper-clad laminates have a certain degree of flexibility, which can adapt to complex circuit layouts and bending requirements, facilitating the design and manufacturing of circuit boards

3. Heat resistance: High frequency flexible copper-clad laminates can maintain stable performance in high temperature environments and are not prone to deformation or failure.

4. High density: The copper foil layer of high-frequency flexible copper-clad laminates is relatively thin, but the conductivity and signal transmission speed of the circuit board can be improved by increasing the number of layers.

5. Environmental friendliness: High frequency flexible copper-clad laminates are made of environmentally friendly resins and glass fibers, which meet environmental requirements.

High frequency LCP flexible double-sided copper-clad laminateThe inner middle of the copper-clad board is integrally formed with a thin film, and the top surface of the thin film is hot pressed with an upper copper foil, while the bottom surface of the thin film is hot pressed with a lower copper foil Advanced Institute Technology's new product is made of liquid crystal polymer film with a thickness of 25/50/75/100um LCP, and double-sided copper-clad laminate with a thickness of 12/18um electrolytic copper foil/rolled copper foil and low roughness (VLP). This material has low dielectric and low loss properties, meets the requirements of 5G communication, is practical, and suitable for widespread promotion and use

Liquid crystal polymer (LCP) is a type of liquid crystal polymer that performs well as a substrate material in microwave/millimeter wave circuits and has received widespread attention in 5G packaging The experiment of removing the film from LCP flexible copper-clad laminates was carried out using ultraviolet nanosecond laser. At a repetition rate of 200 kHz, the effects of different laser powers, scanning speeds, and scanning layers on the film removal depth of LCP materials were studied by controlling variables In order to reduce the impact of thermal effects on electronic devices and flexible circuit boards, combined with the characteristics of LCP and actual processing results, further analysis is conducted on the variation law of the heat affected zone range at the LCP substrate frame with laser parameters The experimental results show that with the goal of low heat affected processing, when the scanning layer number is 5, the scanning speed is 600 mm/s, and the average laser power is 2.1 W, the uniformity is good, and the processing depth can reach 49.84 m. The heat affected zone at the frame is relatively small, reaching 28.43 m