PI copper-clad laminates have unique performance advantages and a wide range of application fields

Using PI copper-clad laminate as the writing theme,Advanced Institute of TechnologyStarting from the key points that the target readers are most concerned about, we will demonstrate the advantages and value of this product. The article will conduct in-depth analysis from multiple dimensions by providing examples and citing data.

1、 Glass transition temperature (Ig): ensuring stable performance in high-temperature environments

The glass transition temperature refers to the temperature at which a material transitions from a solid state to a liquid or transition state at high temperatures. aboutPI copper-clad laminateIn terms of glass transition temperature (LGS-M<300 ° C), it can ensure excellent performance even in high temperature environments. For example, when the product is applied to high-temperature equipment in the aerospace industry, it can withstand long-term high-temperature operations without performance degradation or damage.

2、 Flame resistance: ensuring the safety performance of the product in the event of a fire

Flame resistance refers to the self extinguishing ability of materials during combustion and the absence of excessive toxic gases. PI copper-clad laminates have advanced flame resistance VTM-0, which means that under experimental conditions, the combustion time of the product is less than 10 seconds, and it will not continue to burn and self extinguish. This feature ensures that in emergency situations such as fires, PI copper-clad laminates will not exacerbate the fire, thereby ensuring the safety of equipment and personnel.

3、 Tensile strength and elongation: providing excellent mechanical properties

Tensile strength and elongation are important indicators for evaluating the mechanical properties of materials. For PI copper-clad laminates, it has high tensile strength (LGS-H>350MPa) and high elongation (>45%), which means that the product can maintain good stability and reliability under stress. Whether in mechanical motion or under external stress environments, PI copper-clad laminates can provide high-strength support and are not easily deformed or broken.

4、 Peel strength: Ensure a stable connection between the copper coating and the substrate

Peel strength refers to the bonding strength between the copper coating and the substrate. For PI copper-clad laminates, their peel strength is 18.3 (N/mm), which means that the connection between the copper-clad layer and the substrate is very stable and not prone to peeling or detachment. This strong peel strength ensures the stability and reliability of PI copper-clad laminates in applications such as high-frequency signal transmission and circuit connections.

5 CTEXY/Z： Having an extremely low coefficient of thermal expansion

CTE is an abbreviation for coefficient of linear expansion, used to describe the degree of change in length or volume of a material under temperature changes. For PI copper-clad laminate, its CTEXY/Z is 1.2ppm/° C, indicating that it has a very low coefficient of thermal expansion. This feature enables PI copper-clad laminates to maintain stable size and shape in high temperature environments, and is less prone to problems such as thermal expansion and contraction.

6、 Surface resistance and volume resistivity: meet the requirements of high-frequency signal transmission

Surface resistance and volume electronegativity are important indicators for evaluating the conductivity of materials. For PI copper-clad laminates, they have high surface resistance (>1014Q. cm) and high volume electronegativity (>1014Q. cm), which means that in applications such as high-frequency signal transmission, the product can provide excellent conductivity, ensuring the quality and stability of signal transmission.

7、 Thermal conductivity: provides efficient heat dissipation performance

Thermal conductivity refers to the ability of a material to conduct heat. For PI copper-clad laminates, their thermal conductivity is 0.28-0.30W/(m · K), which means they have high thermal conductivity. This feature enables PI copper-clad laminates to conduct and dissipate heat more effectively, thereby maintaining the normal operating temperature of the equipment and avoiding situations where overheating leads to decreased or damaged equipment performance.

8、 Breakdown voltage: Ensure electrical insulation performance

The breakdown voltage refers to the critical voltage at which a material's insulation fails under the action of an electric field. For PI copper-clad laminates, their breakdown voltage can reach up to KV/mm, ensuring good insulation during use and avoiding electrical faults.

in summary,PI copper-clad laminateWith its unique performance advantages and wide range of application fields, it has become a hot topic of concern for target readers. Its stable performance, safe and reliable flame resistance, excellent mechanical properties, reliable connection performance, low thermal expansion, high conductivity, high thermal conductivity, and good electrical insulation performance make PI copper-clad laminates widely used in industries such as electronics, aerospace, and automotive. Whether in high-temperature environments or special working conditions such as high-frequency signal transmission, PI copper-clad laminates can provide stable and reliable performance support to meet the needs of target readers.