The relationship between the mechanical strength of the cured layer and the additives in the solderable conductive copper paste

With the rapid development of electronic technology, the application of solderable conductive copper paste in electronic manufacturing is becoming increasingly widespread. The mechanical strength of the cured layer is one of the important indicators for evaluating the performance of solderable conductive copper paste, and additives, as an important component of solderable conductive copper paste, have a crucial impact on the mechanical strength of the cured layer. This article will delve into the relationship between the mechanical strength of the cured layer and additives in solderable conductive copper paste, and introduce the research and development of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum Brand YB5109 Solderable Conductive Copper PasteInnovative practices in additive selection and application.

1、 The influence of additives on the mechanical strength of cured layers

There are various types of additives in solderable conductive copper paste, including dispersants, wetting agents, coupling agents, defoamers, etc. These additives play an important role in the preparation, coating, curing and other processes of copper paste, and also have a significant impact on the mechanical strength of the cured layer.

1.1 Dispersant

Dispersants can improve the dispersibility of copper powder in the carrier, prevent copper powder agglomeration, and thus enhance the uniformity and stability of copper paste. Meanwhile, dispersants can also increase the interaction force between copper powder and the carrier, which helps to improve the mechanical strength of the cured layer.

1.2 Wetting agent

Wetting agents can reduce the surface tension of copper paste, improve the wettability of copper paste to the substrate, and form a uniform coating layer of copper paste on the substrate. Good wettability helps copper paste form a dense cured layer during the curing process, thereby improving the mechanical strength of the cured layer.

1.3 Coupling agent

Coupling agents can improve the interfacial bonding between copper powder and carrier, and enhance the cohesion of the cured layer. By introducing coupling agents, a strong chemical bond can be formed between copper powder and the carrier, thereby improving the mechanical strength of the cured layer.

1.4 Defoamer

Defoamers can eliminate bubbles generated during the preparation and coating process of copper paste, prevent bubbles from forming voids during the curing process, and affect the density and mechanical strength of the cured layer.

2、 Innovative Practice of YB5109 Solderable Conductive Copper Paste from Yanbo Brand

The YB5109 solderable conductive copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has undergone multiple innovative practices in additive selection and application.

2.1 Selected high-efficiency additives

Research Platinum Brand YB5109 Solderable Conductive Copper PasteSelected a variety of efficient additives, including dispersants, wetting agents, coupling agents, and defoamers. These additives have been carefully screened and proportioned to fully utilize their respective functions, synergistically improving the performance of copper paste and the mechanical strength of the cured layer.

2.2 Unique additive combinations

The YB5109 solderable conductive copper paste from Yanbo brand adopts a unique combination of additives. By optimizing the proportion and types of various additives, the performance of the copper paste is optimized. This unique combination of additives not only improves the uniformity and stability of the copper paste, but also significantly enhances the mechanical strength of the cured layer.

2.3 Strict Quality Control

Advanced Institute (Shenzhen) Technology Co., Ltd. has strictly controlled the quality of the production process of YB5109 solderable conductive copper paste for the research platinum brand. From raw material procurement, additive selection, preparation process to finished product testing, every step has been strictly controlled and tested to ensure the quality and stability of copper paste performance.

3、 Conclusion

The mechanical strength of the cured layer andSolderable conductive copper pasteThe relationship between additives is closely related. By selecting appropriate additives and optimizing the combination of additives, the mechanical strength of the cured layer can be significantly improved. The innovative practice of selecting and applying additives for the YB5109 solderable conductive copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. provides a high-performance and highly reliable solution for the electronic manufacturing industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.