Advanced Institute of Technology
Ultra fine 0.02mm tinned copper foilIt is a star in the black technology industry, hiding numerous detailed and eye-catching technical parameters. This ultra-fine copper foil can be tinned through two methods: weldable tin plating or non weldable tin plating, to meet different welding requirements. The width of this product does not exceed 300mm, and the thickness is between 0.035 and 0.15mm. The thickness of the tin plating layer is also quite important, at least 0.3 microns or 0.2 microns are required.
An important technical parameter is the tin content of the tin plating layer. According to the customer's welding process requirements, the tin content of the tin plating layer can be adjusted within the range of 65% to 92%. However, non solder tinned copper foil is coated with 100% pure tin.
In addition to tin content, surface resistance after tin plating is also a key factor. The surface resistance range of ultrafine 0.02mm tinned copper foil is between 0.3 and 0.5 ohms, while
Non welding tin platingThe copper foil is between 0.1 and 0.15 ohms. This parameter has a significant impact on the performance and functionality of many electronic devices.
In addition, the tinned copper foil needs to have good adhesion. This means that the tin plating layer not only needs to have sufficient thickness and tin content, but also needs to be firmly attached to the surface of the copper foil to ensure that it does not peel or detach during use.
Ultra fine 0.02mm tinned copper foilThe adhesion has reached the standard of 5B.
The control of substrate performance degradation after electroplating is also crucial. Tensile strength and elongation are key indicators for evaluating the degradation of substrate properties after electroplating. The tensile strength attenuation of the copper foil after electroplating is limited to within 10%, while the elongation attenuation is limited to below 6%.
Ultra fine 0.02mm tin plated copper foil is widely used in various fields due to its excellent technical parameters. In the electronics industry, it is commonly used in semiconductor packaging, battery connectors, touch screen conductive layers, and other fields. In the medical industry, it can be used as a flexible circuit board for medical electrodes, biosensors, and medical devices. In addition, it can also be applied in aerospace, communication, energy and other fields to meet various high-precision and high stability requirements.
The technological black technology of ultra-fine 0.02mm tin plated copper foil is not only reflected in its inherent technical indicators, but also in the meticulous processing of its materials and advanced manufacturing processes. Through precise control and highly automated production lines, the uniformity and stability of the tin plating layer can be achieved, ensuring that every copper foil has excellent performance and reliability.
Although this article is not organized using conventional structured vocabulary, we can still understand the ultrafine 0.02mm material
Tin plated copper foilThe hidden technology behind it is black technology. Through the introduction of technical parameters, we can feel the strength and potential of this precision manufactured product. Whether in electronics, healthcare, or other fields, this tin plated copper foil will bring higher performance and wider applications.
