With the continuous advancement of technology and the expansion of application fields,
Low temperature curing electronic pastePlaying an increasingly important role in the electronics industry. In this context,
silver flakeAs a key material, it has become a highly anticipated product in the market due to its unique properties and wide applicability. This article will focus on several main grades and specifications of flake silver powder, and explore their application prospects from different perspectives.
1 YB-8910： Optimization of Low Temperature Curing Electronic Paste with Medium to Low Silver Content
YB-8910 flake silver powder is a professionally designed and developed product, with a particle distribution range of D10 between 2.0-4.0 μ m, D50 between 5.0-8.0 μ m, and D90 between 8.0-15.0 μ m. From the perspective of surface density, its density is between 1.6-2.4 g/cm3, while its bulk density is between 3.0-4.2 g/cm3. In addition, its specific surface area is 0.8-1.5m2/g. These features make YB-8910 flake silver powder the preferred choice for low-temperature curing electronic pastes with low to medium silver content.
For low-temperature cured electronic pastes with low to medium silver content, the particle size distribution and density characteristics of the material are particularly important. The particle size distribution range of YB-8910 flake silver powder is wide, which can adapt to the electronic paste requirements of different thicknesses and viscosities. Moreover, its lower surface density and higher bulk density can increase the viscosity of the slurry, thereby enhancing the reliability and stability of electronic components.
II YB-8920： Achieve excellent performance of low-temperature cured electronic paste with low to medium silver content
Similar to YB-8910,
YB-8920 flake silver powderIt is also an ideal choice for low-temperature curing electronic pastes with low to medium silver content. Its particle size distribution range and density characteristics are similar to YB-8910, which further demonstrates its outstanding performance in this field.
YB-8920 flake silver powder not only meets the requirements of electronic paste particle size range, but also exhibits good weldability and conductivity during low-temperature curing process. For electronic pastes with low to medium silver content, weldability is a crucial indicator. The optimization of YB-8920 flake silver powder in terms of chemical composition and microstructure enables it to achieve excellent welding results, thereby improving the reliability and stability of the product.
III YB-8930： A wise choice for high silver content electronic pastes
In addition to YB-8910 and YB-8920, which are suitable for electronic pastes with low to medium silver content, there are also grades and specifications that are suitable for
High silver content electronic pasteYB-8930. The particle size distribution range is more detailed: D10 is 1.0-2.0 μ m, D50 is 2.0-4.0 μ m, and D90 is 3.0-5.0 μ m. This makes YB-8930 flake silver powder an ideal choice for preparing high silver content low-temperature curing and sintering electronic pastes.
Good dispersion and high conductivity of silver powder are crucial in high silver content electronic pastes. YB-8930 flake silver powder ensures the purity and dispersibility of silver powder particles through precise purification and grinding processes. This not only improves the conductivity of the slurry, but also effectively reduces the resistance and heat dissipation of electronic components, enhancing the performance and reliability of the product.
Conclusion: The continuous development and increasing demand in fields such as consumer electronics, photovoltaic energy, and automotive electronics have led to
Low temperature curing electronic pasteAnd as a key material, flake silver powder has broad market prospects. Different grades and specifications of flake silver powder are suitable for different application requirements and can meet the special needs of various electronic products. I believe that the widespread application of flake silver powder will bring more opportunities and development space to the electronics industry.
