High reliability and high-density thick film integrated circuit gold conductor paste

Gold conductive pasteIt is a thick film paste with gold as the conductive phase, commonly used in multi-layer wiring conductors, gas sensors, microwave hybrid integrated circuits, high-power transistor chips and lead frames, and other high reliability, high-density thick film integrated circuits. Gold conductive paste has excellent performance, but its use is limited due to the high price of gold.
Gold as the main functional phaseConductive pasteExcellent performance, good conductivity, high fine line resolution, excellent printing performance, smooth film surface, low backlight porosity, low film edge shrinkage rate, and high cross-sectional density.

Gold conductive pasteIt is commonly used in thick film integrated circuits with high reliability and density, such as multi-layer wiring conductors, gas sensors, microwave hybrid integrated circuits, high-power transistor chips, and lead frames. Although gold conductive paste has excellent performance, its use is limited due to the high price of gold.

The conductive paste prepared from gold powder with a generally spherical or quasi spherical morphology, high tap density, and particle size in micrometers or sub micrometers has the best performance.

The effects of three different reducing agents, ascorbic acid, sodium sulfite, and oxalic acid, on the morphology of gold powder were studied using chloroauric acid as the raw material Three types of gold powder were used as conductive fillers to prepare gold conductor pastes suitable for screen printing, and the influence of gold powder morphology on the properties of the paste printed film layer was studied The results showed that the viscosity and thixotropy of the slurry prepared from gold powder using gelatin as a dispersant and oxalic acid as a reducing agent were more suitable for screen printing technology. The printed film layer was flat, defect free, and had better adhesion and resistance than gold powder prepared from ascorbic acid and sodium sulfite as reducing agents after firing
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