Preparation method of chip resistor paste: strategy for achieving low resistance and high compatibility

As a key material in electronic component manufacturing, the performance of chip resistor paste directly affects the overall quality and reliability of electronic products. In the preparation process, achieving low resistance and high compatibility is the key to improving the performance of electronic components. This article will explore how to achieve this goal through specific preparation methods.

1、 Low resistance implementation strategy

1. Optimization of conductive phase materials:
   • The application of efficient conductive materials: Traditional conductive phase materials such as silver powder have good conductivity, but the cost is relatively high. In recent years, the use of carbon nanotube loaded platinum ruthenium alloy nanoparticles and other new conductive materials has not only improved the conductivity of resistance slurries, but also reduced costs.
   • The increase in volume fraction of conductive phase: By using paste like materials such as silver nanoparticles, palladium nanoparticles, and ruthenium dioxide nanoparticles wrapped in fly ash as conductive phase, the volume fraction of conductive phase is increased, resulting in a denser distribution of conductive particles and effectively reducing the resistance value.
2. Adjustment of the ratio of glass phase to additives:
   • The bonding effect of glass phase: Glass phase plays a role in bonding and fixing during the sintering process. By optimizing the ratio of glass phase, it can ensure that the resistance paste forms a good conductive layer after sintering.
   • The regulating effect of additives: Additives can regulate the rheological, dispersibility, and sintering properties of the slurry. Through precise proportioning, the resistance value can be further reduced and the conductivity can be improved.
3. Improvement of decentralized technology:
   • Advanced dispersion equipment and technology: Advanced dispersion equipment and technology such as TRILOS three roll machine are used to ensure uniform dispersion of particles in the slurry, avoid agglomeration, thereby improving the uniformity and stability of the resistance slurry and further reducing the resistance value.

2、 High compatibility implementation strategy

1. Multi layer structure design:
   • Multi functional implementation: By designing multi-layer structures, the performance requirements of electronic components under different conditions can be met, such as simultaneously achieving high resistance, high precision, and low temperature coefficient, thereby improving the compatibility of electronic components.
2. Special shape design:
   • Integration and performance improvement: Design special shaped resistor paste according to application requirements, such as spiral, mesh, etc., to improve the integration and performance of circuit boards. This design can make electronic components more compact, efficient, and improve their anti-interference ability and stability.
3. Environmental Protection and Intelligence Trends:
   • Green manufacturing: using environmentally friendly materials and processes to reduce the impact on the environment and meet the requirements of green manufacturing. This helps to enhance the market competitiveness of electronic components and meet the compatibility needs of more fields.
   • Intelligent integration: By integrating sensors, actuators, and other components, intelligent and adaptive control of resistance paste can be achieved. This trend towards intelligence can enable electronic components to have higher levels of automation and intelligent control capabilities, thereby improving their performance and compatibility.

3、 Preparation methods and examples

1. Overview of Preparation Methods:
   • After mixing glass powder, functional material powder (such as conductive phase material), organic carrier, and additives evenly, roll them with a three roll mill to a fineness of ≤ 5 μ m to obtain a slurry. During the mixing process, it can be left to settle for a period of time to complete infiltration and ensure that all components are fully mixed.
2. Preparation Example:
   • A slurry is prepared by mixing lead ruthenate and ruthenium oxide as functional phases, glass powder as a binder, organic carriers and additives as auxiliary materials in a certain proportion. Through process steps such as screen printing, leveling, drying, and sintering, chip resistors with low resistance and high compatibility are obtained.

4、 Conclusion

By optimizing conductive phase materials, adjusting the ratio of glass phase to additives, improving dispersion technology, designing multi-layer structures and special shapes, and adopting environmentally friendly and intelligent trends, chip resistor slurries with low resistance and high compatibility can be prepared. These strategies not only improve the performance and reliability of electronic components, but also meet the needs of miniaturization, intelligence, and multifunctionality of electronic products. With the continuous development of electronic technology, the preparation technology of chip resistor paste will continue to innovate and improve, providing strong support for the development of the electronics industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.