superfine
0.02mm tinned copper foilOne of its main characteristics is its extremely high conductivity. Based on the conductivity of the surface of metal materials, a high-purity oxygen free copper conductive layer is deposited on the surface of PET film to give it the conductivity of metal materials. According to ASTM D991 standard, the Cu surface resistance of this material can reach ≤ 0.5 Ohm/sq, which means it can provide a more stable and low impedance conductive path, ensuring the normal operation of electronic products.
For example, ultrafine tin plated copper foil can be widely used in electrode circuits commonly used in electronic products. By organically combining ultrafine tin plated copper foil with other devices, reliable connections between electronic components can be achieved, enabling smooth current transmission and thus improving the overall performance of the devices.
Achieve excellent thermal conductivity
In addition to its eye-catching performance in conductivity, ultra-fine 0.02mm tin plated copper foil also has excellent thermal conductivity. stay
Tin plated copper foilDuring the preparation process, a layer of high-purity oxygen free copper was deposited on the surface of PET film using vacuum magnetron sputtering technology. This design makes ultrafine tin plated copper foil play an important role in the thermal management of electronic products.
Taking the heat dissipation of electronic products as an example, due to the thermal conductivity of ultra-fine tin plated copper foil, it can quickly conduct the heat generated in electronic products to the external environment, reduce the temperature rise of the product, and avoid damage to electronic components caused by overheating. This excellent thermal conductivity makes ultrafine tin plated copper foil widely applicable in thermal management of electronic products.
Effectively suppress electromagnetic interference
In modern society, electronic products are often plagued by electromagnetic interference during use. The ultra-fine 0.02mm tin plated copper foil can effectively suppress electromagnetic signal interference and improve the anti-interference ability of the product by forming a shielding layer.
Taking electromagnetic shielding as an example, ultrafine tin plated copper foil can be used for the production of the outer shell or internal structure of electronic products, forming a shield against electromagnetic waves and protecting the electronic components inside the product from electromagnetic interference from the outside world. This technology application makes ultrafine tin plated copper foil play an indispensable role in the design of electronic products.
Conclusion:
Ultra fine 0.02mm tinned copper foilWith its extremely high conductivity, excellent thermal conductivity, and effective suppression of electromagnetic interference, it has become an important black technology in the field of modern electronic technology. It plays an important role in the heat dissipation, electrode circuits, and electromagnetic shielding of electronic products, providing strong support for the functional improvement and performance optimization of electronic products. I believe that with the continuous advancement of technology, ultrafine tin plated copper foil will show broader application prospects in more fields.
