Advanced Institute of Technology sintering at 850 ° CAlloy gold pasteIt is a type of substance that does not contain glass phaseGold conductor pasteSuitable for exhibiting excellent adhesion on alumina and beryllium oxide. This gold paste is commonly used in high reliability and high-power hybrid circuit modules, particularly suitable for aluminum wire compression, especially for applications with large diameter aluminum wires (such as 500 micron aluminum wires).
1、 Application of alloy gold paste on alumina
1. Provide high adhesion: at high temperatures
Alloy gold paste sintered at 850 ° CIt can ensure excellent adhesion on alumina. This excellent adhesion can ensure the stability and reliability of the applied alloy gold paste under high temperature, high pressure, and harsh environments.
2. Suitable for high-power applications: The application of alloy gold paste on alumina is very suitable for high-power circuits, which can meet higher requirements for current density and conductivity in application scenarios. By utilizing the conductive advantage of alloy gold paste, higher power transmission and lower energy loss can be achieved.
Taking a high-power processor as an example, it uses alloy gold paste sintered at 850 ° C on alumina as the connecting material. Due to the excellent adhesion and conductivity of the alloy gold paste, the processor can operate continuously and stably, and maintain a low temperature under high loads.
2、 Application of Alloy Gold Paste on Beryllium Oxide
1. Suitable for high reliability circuits: The application of alloy gold paste sintered at 850 ° C on beryllium oxide is very suitable for circuits with high reliability requirements. Alloy gold paste can form reliable connections at high temperatures, enabling circuit modules to operate stably for long periods of time in harsh environments.
2. Provide excellent circuit performance: Alloy gold paste on beryllium oxide can not only provide stable connections, but also excellent circuit performance. Alloy gold paste has high conductivity and low resistance, which can ensure efficient operation and low energy loss of circuits.
The circuit modules in a high-tech spacecraft are connected to beryllium oxide using alloy gold paste sintered at 850 ° C by Advanced Institute Technology. By using alloy gold paste, this circuit module can operate reliably in extreme temperature and radiation environments, and provide excellent circuit performance, providing important functional support for spacecraft.
Argument and analysis: The sintering temperature of 850 ° C for alloy gold paste can ensure the solution to the adhesion and stability problems of traditional gold conductor paste in high temperature environments. Moreover, through alloying treatment, the conductivity of the alloy gold paste is superior, providing higher performance guarantee for high-power applications. In addition, the alloy gold paste has good adhesion and stability on both alumina and beryllium oxide, making it suitable for applications with high requirements for reliability and circuit performance.
Summary: Advanced Institute of Technology
Alloy gold pasteIt is a gold conductor paste sintered at 850 ° C, suitable for exhibiting excellent adhesion on alumina and beryllium oxide. Alloy gold paste can play an excellent role in both high reliability and high-power circuit modules, as well as in scenarios that require high adhesion and excellent circuit performance. Through the application of alloy gold paste, we can ensure the stable operation of circuits in harsh environments and provide higher power transmission and lower energy loss.
