IGBT sintered silver process

IGBT sintered silver processIt is a critical process that directly affects the performance and reliability of the device. Among them, cleaning the bonding interface, interface surface energy being too low, bonding size being too large, coating uniformity, pressure method, and drying and cooling processes are all important aspects that need attention.

Firstly, cleaning the bonding interface is the foundation for ensuring the quality of sintered silver bonding. Before bonding, it is necessary to thoroughly clean the interface to remove dirt and oxides, ensuring the purity of the interface. Only a clean interface can effectively improve the adhesive strength and reliability of the interface.

Secondly, a low interface surface energy can affect the contact performance between sintered silver and the substrate. Suggest increasing surface energy on the interface to improve its wetting and sealing properties. This can be achieved by adding appropriate enhancers on the interface or changing the formula of the coating material. Increasing the surface energy of the interface helps to improve the wettability of sintered silver and enhance its bonding strength.

When the bonding size is too large, gas problems are prone to occur. To solve this problem, a gas channel can be opened on one interface to facilitate the smooth discharge of gas. This can effectively avoid gas troubles and improve the quality and reliability of sintered silver.

In addition, the uniformity of coating is very important when applying sintered silver at an interface. Uniform coating can ensure the uniform distribution of sintered silver on the entire interface, thereby improving the quality and reliability of the interface. To achieve this, suitable coating processes and equipment can be used, and the amount of coating agent and coating speed can be strictly controlled.

Meanwhile, when placing sintered silver on another interface, it is recommended to apply some pressure to the upper interface to ensure a tight contact between the sintered silver and the interface. This can be achieved by adjusting pressure and time. Moderate pressure can help sinter silver and form a good bond with the interface, improving the strength and reliability of the interface.

In the drying stage of the process, the pre drying stage is an essential step. For copper substrates with interfaces, it is recommended to use nitrogen protection during the pre drying process. This can effectively prevent oxidation and maintain the purity of the interface. Of course, nitrogen protection is not required for substrates such as gold or silver.

In addition to the pre drying stage, the pre pressing stage is also an important step. In the preloading stage, it is necessary to adjust the temperature to 150 degrees and apply moderate pressure (0.5-1MPa) and time (1-3 seconds). This can make the interface more closely adhere, improve bonding strength and reliability.

In this pressure stage, the temperature needs to be raised to 220-280 degrees and a higher pressure (10-30MPa) should be applied for 2-6 minutes. This stage is the most critical step in the entire sintering process, which determines the bonding quality and reliability of sintered silver. To ensure good sintering results, it is necessary to strictly control parameters such as temperature, pressure, and time.

Finally, at the end of sintering, it is recommended to gradually cool down to room temperature in the oven before removing the device. This can effectively avoid thermal stress caused by temperature differences, ensuring the overall stability and reliability of the device.

in general,IGBT sintered silver processIt is a complex and critical process, and based on a thorough understanding and mastery of each link, optimization and improvement can effectively improve the bonding quality and reliability of sintered silver. Cleaning the bonding interface, increasing interface surface energy, improving bonding size, coating uniformity, appropriate pressure, reasonable drying and pre pressing stages, precise control of parameters in this pressing stage, and appropriate cooling process are all key points that need attention and focus. Only by achieving precise operation and control at every stage can the quality and reliability of sintered silver be ensured, and the performance of the device be improved.