Thermal conductive silicon gel gasketIt is a new type of thermal conductive material with excellent thermal conductivity and stability, mainly used in electronic devices, aerospace, rail transit and other fields.
The manufacturing process of thermal conductive silicon gel gasket includes:
Raw material preparation: Qualified organic silicone rubber, thermal conductive fillers, curing agents, and other substances need to be used as raw materials, which require fine filtration before use.
Raw material mixing: Mix the raw materials in a certain proportion to obtain a uniform adhesive solution.
Molding: The adhesive liquid is made into a gasket like material through pressing, hot pressing, and other methods. The thickness and shape of the gasket can be made according to actual needs, usually circular, square, or other specific shapes. The formed gasket needs to undergo curing treatment to have good thermal conductivity and stability.
Common application scenarios:
In electronic equipment, aerospace, rail transit and other fields, thermal conductive silicon gel gaskets can be used as thermal conductive fillers to improve the heat dissipation capacity of equipment. In the aerospace field, thermal conductive silicon gel gaskets can be used as thermal insulation materials to reduce the temperature difference between internal components and improve the operational efficiency of aircraft.
Thermal conductive silicon gel gasket is a new thermal conductive material with broad application prospects, which has excellent thermal conductivity and stability. It has been widely used in electronic devices, aerospace, rail transit and other fields, becoming an important means of heat dissipation management in these areas.