Solving the agglomeration problem of pressureless sintered nano copper paste during storage

Non pressure sintered nano copper paste has shown great potential in the field of electronic component interconnection due to its excellent conductivity and low-temperature sintering performance. However, during storage, nano copper particles are prone to agglomeration, which not only affects the coating uniformity and sintering performance of copper paste, but also reduces its conductivity and reliability. This article will explore how to solve the agglomeration problem of pressureless sintered nano copper paste during storage, and introduce the research platinum brand developed by Advanced Institute (Shenzhen) Technology Co., LtdYB5108 pressureless sintered nano copper pasteInnovative practices in addressing the issue of reunion.

1、 The Causes of Reunion Issues

The main reasons for the aggregation of nano copper particles during storage are as follows:

1. High surface energy: Nano copper particles have extremely high surface energy, which makes them easily attract and aggregate together, forming aggregates.
2. Surface oxidation: The surface of nano copper particles is highly prone to oxidation, and the generated copper oxide will further promote agglomeration.
3. Electrostatic effect: Nano copper particles may carry static electricity during the drying process, causing mutual attraction between particles and forming agglomeration.

2、 Methods to solve the problem of reunion

2.1 Adding dispersant

Adding an appropriate amount of dispersant can effectively prevent the agglomeration of nano copper particles when preparing pressureless sintered nano copper paste. Dispersants can adsorb onto the surface of nano copper particles, forming a protective film that prevents direct contact and agglomeration between particles. Meanwhile, dispersants can also increase the electrostatic repulsion between particles, further improving dispersion stability.

2.2 Control storage conditions

When storing pressureless sintered nano copper paste, adverse conditions such as high temperature, high humidity, and strong light should be avoided as much as possible. High temperature will accelerate the movement and collision of nano copper particles, increasing the possibility of agglomeration; High humidity and strong light exposure may promote the oxidation and aggregation of nano copper particles. Therefore, it is necessary to choose a cool, dry, and dark environment for storage, and strictly control the storage temperature and humidity.

2.3 Regular mixing

Regularly storingPressureless sintering of nano copper pasteStirring can break the formed aggregates and disperse the nano copper particles evenly again. Appropriate mixing speed and time should be selected during mixing to avoid excessive shear force or introduction of impurities on the copper slurry.

2.4 Adopting vacuum packaging

Vacuum packaging can effectively isolate air and moisture, reduce the contact opportunities between nano copper particles and oxygen and water molecules, thereby reducing the risk of oxidation and agglomeration. Before packaging, the pressureless sintered nano copper paste should be thoroughly degassed to eliminate bubbles and volatile substances.

3、 Innovative practice of YB5108 pressureless sintered nano copper paste from Yanbo brand

The YB5108 pressureless sintered nano copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has undergone multiple innovative practices in solving agglomeration problems.

3.1 Unique dispersant system

Yanbo brand YB5108 pressureless sintered nano copper pasteA unique dispersant system is adopted, which is composed of multiple efficient dispersants and can cover the surface of nano copper particles in all directions, forming a stable protective film and effectively preventing agglomeration. At the same time, the dispersant system also has good wetting and dispersibility, which can ensure that the nano copper particles remain uniformly dispersed during storage.

3.2 Advanced Storage Technologies

Yanbo brand YB5108 pressureless sintered nano copper paste adopts advanced vacuum packaging technology and temperature and humidity control technology during storage. Vacuum packaging technology can isolate air and moisture, reducing the risk of oxidation and agglomeration; Temperature and humidity control technology can maintain the stability and consistency of the storage environment, avoiding the adverse effects of high temperature, high humidity, and strong light on copper paste.

3.3 Regular Inspection and Maintenance

YB5108 pressureless sintered nano copper paste from Yanbo brand has undergone regular testing and maintenance during storage. By regularly testing the dispersibility, conductivity, and stability of copper paste, agglomeration issues can be detected and addressed in a timely manner. At the same time, regular maintenance and upkeep have been carried out on the storage equipment to ensure its normal operation and stability of the storage environment.

4、 Conclusion

Pressureless sintering of nano copper pasteThe agglomeration problem during storage is an urgent technical challenge that needs to be solved. By adding dispersants, controlling storage conditions, regular stirring, and using vacuum packaging, the agglomeration of nano copper particles can be effectively prevented. The YB5108 pressureless sintered nano copper paste developed by Advanced Institute (Shenzhen) Technology Co., Ltd. has undergone multiple innovative practices in solving agglomeration problems, providing strong support for the storage and application of pressureless sintered nano copper paste.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.