abstract
Thermal conductive silicon gelIt is an important thermal conductive material widely used in fields such as electronics, optoelectronics, aerospace, etc. As a relatively new material, one component thermal conductive silicon gel has gradually attracted people's attention. In this paper, the preparation methods, properties and applications of single component thermal conductive silicon gel are reviewed, in order to provide some reference for the research in this field.
Overview of thermal conductive silicon gel
Thermal conductive silicon gel refers to a material with both thermal conductivity and insulation, which can effectively transfer heat, and has excellent high temperature resistance, corrosion resistance and other characteristics. Thermal conductive silicon gel is an indispensable high-performance material in the fields of electronics, optoelectronics, aerospace and other fields. At present, the commonly used thermal conductive silicon gel is mainly two-component or multi-component, which not only has a complex preparation process, but also has a high cost. The single component thermal conductive silicon gel has the characteristics of one-time molding, and can meet the market demand better than other thermal conductive silicon gel.
Preparation method of single component thermal conductive silicon gel
One component thermal conductive silicon gel is usually prepared by suspending nano silica and other thermal conductive materials in silicone resin. On this basis, by adding modifier, curing agent and other auxiliary substances, and adjusting the mechanical properties, thermal conductivity and other characteristics of silicon gel, the preparation of single component thermal conductive silicon gel can be achieved.
Properties of one component thermal conductive silicon gel
heat conductionperformance
The thermal conductivity of single component thermal conductive silicon gel is mainly affected by thermal conductive materials. For example, nano silica has excellent thermal conductivity, which can improve the thermal conductivity of the entire silicon gel. In addition, the curing mode and curing time of silicon gel also affect the thermal conductivity.
Mechanical performance
Mechanical property is one of the key indicators to evaluate whether silicon gel is suitable for application. The mechanical properties of single component thermal conductive silicon gel are usually controlled by modifiers, curing agents, etc. Appropriate silicon gel preparation scheme should be selected according to specific application scenarios.
High temperature resistance performance
In high temperature environment, silicon gel will undergo thermochemical reaction, which will lead to performance degradation. Therefore, it is very important to improve the high temperature resistance of silicon gel. One component thermal conductive silicon gel can improve its high temperature resistance by controlling the length of silicon chain and adding appropriate additives.
Application of single component thermal conductive silicon gel
One component thermal conductive silicon gel has been gradually applied because of its simple preparation and low cost. At present, the single component thermal conductive silicon gel is mainly used in the heat dissipation of electronic equipment, LED lamps, power supplies and other fields. With the continuous progress of technology, the application range of single component thermal conductive silicon gel will continue to expand.
conclusion
One component thermal conductive silicon gel has the characteristics of one-time molding, simple preparation and low cost. In the application field of thermal conductive materials, the single component thermal conductive silicon gel will gradually replace the traditional two-component or multi-component thermal conductive silicon gel and become a new research hotspot.
