FPCB、 Heat dissipation film, applied to high-performance materials such as PI copper plating film for smartphones, semiconductors, automobiles, and aviation

5G mobile phone; MPI antennas and graphite heat dissipation film MPI antennas are being used as antenna manufacturing materials in the 4G eraPI film (polyimide) copper plated and gold platedHowever, PI has significant losses above 10GHz, which cannot meet the needs of 5G terminals; LCP copper plating (Liquid Crystal Polymer) is gradually being applied due to its lower meson and conductor losses, flexibility, and sealing properties. However, due to the high cost and complex process of LCP, currently MPI (Modified Polyimide) is expected to become one of the mainstream choices for antenna materials in the 5G era due to its wide operating temperature, easy operation under low-temperature pressed copper foil, easy surface adhesion with copper, and affordable price.
Currently, Advanced Institute Technology is developing and applying modified PI copper plating for 5G applicationsLCP nickel plated copperThe product has been completed and is ready for mass production to meet the high frequency and high-speed demands of 5G. At present, the main material for graphite heat dissipation fins is artificial graphite sheets. The main raw material for artificial graphite sheets is polyimide film (PI film), which is produced through two high-temperature processes: carbonization and graphitization. Carbonization is a pre graphitization process aimed at evaporating all or most of the non carbon components in the PI film, which needs to be carried out at a specific high temperature.
In the graphitization process, the issuer further heats up the carbonized PI film by adding argon or nitrogen gas as a medium in a specially designed graphitization furnace. Under high temperature, polycyclic compound molecules are reformed, accompanied by multiple periodic temperature oscillations. Through chemical changes, a high crystallinity large-area graphite original film is finally formed. With the growth of the heat dissipation application market, the proportion of polyimide film in artificial graphite sheets will gradually increase.

In this application field, the thermal conductive film has the ability to supply in bulk to brands such as Huawei, Apple, Samsung, VIVO, etc., generating a sales revenue of 120 million yuan throughout the year. Currently, the second phase expansion project is under construction. In the future, Advanced Institute Technology Company plans to develop a production capacity of over 2 million square meters annually in the polyimide film metal plating material industry.

Modern electronic packaging technology requires the combination of interconnect, power, cooling, and device passivation protection technologies to ensure optimal performance and reliability of the device. Polyimide copper plating largely meets the requirements of high purity, high heat resistance, high mechanical properties, high insulation performance, and high-frequency stability; The requirements of low dielectric constant, dielectric loss, low moisture absorption, low internal stress, low thermal expansion coefficient, and low molding temperature have become the core materials for advanced packaging.

Electrical insulation applications:PI Copper PlatingGold plating is widely used in the manufacturing of power transmission and distribution equipment, variable frequency motors, high-speed traction machines, and high-voltage transformers, and occupies a unique position in the commonly used electrical insulation films. High performance polyimide film can also be used as insulation for high-power electric locomotives, AC generators, radiation resistant motors, and various precision motors. These products have high technical difficulty and added value.

Electronic substrate applications: In the field of electronic substrates, it is used as an insulating base film bonded with copper foil to form the substrate part of FCCL, and can also be covered on the surface of FPC for protection. Products that meet the requirements of high-frequency and high-speed transmission can also

Used in the field of 5G communication.

Application in the field of thermal control: mainly used in the field of electrical thermal control systems, such as the production of high thermal conductivity graphite film precursor PI film through carbonization, graphitization and other processing steps for heat dissipation and conduction. The specially designed PI film structure has the characteristics of easy graphitization and suitable for whole roll firing.

Flexible optoelectronic applications: In the field of device optical cover plates and other applications, it is mainly used as OLED screen cover plates, touch sensor panels, etc., requiring high transmittance, bending resistance and other characteristics.