Silver powder doped with base metals (Ni, Al, Cu, etc.) or other conductive substances in silver conductor paste

althoughGold conductive pasteExcellent performance, but expensive price has always been a constraint on its application. Therefore, in the electronics industry, silver and its compounds with higher cost-effectiveness are used as functional phasesConductive pasteThe research and application of silver powder are the most extensive, with about 80% of thousands of electronic paste products using various types of silver powder as the main functional phase.

Among many precious metals, silver has a relatively low price, which is beneficial for cost control; At the same time, the silver layer can form a continuous, dense, and uniform thin layer on the ceramic surface, which has strong adhesion to the ceramic surface. Therefore, in ceramic conductive layers of the same area and thickness, the capacitance obtained by the silver electrode is larger than that of other electrode materials.

However, silver undergoes electron migration under the action of an electric field, which reduces its conductivity and affects the lifespan of the deviceSilver conductive pasteA major drawback in the use of electronic products is currently that the conductivity of silver paste can be improved by improving the size and morphology of silver powder particles. Reasonable control of the grading of conductive silver powder micro particles and nano particles can prepare conductive paste with denser sintering and better conductivity.

As the most common type of conductive paste, silver paste aims to avoid its own defects caused by silver migration, reduce the amount of silver powder in silver conductive paste, and lower production costs. On the one hand, silver powder tends to be in the form of flakes andNano scale silver powderOn the other hand, by doping base metals (Ni, Al, Cu, etc.) or other conductive substances into silver powder, mixed or composite powders can be made with silver powder to reduce the amount of precious metal silver powder used and lower the production cost of the slurry.

Encapsulation slurry is a lead-free and environmentally friendly encapsulation medium slurry used for covering or interlayer insulation. It does not contain harmful elements such as lead and cadmium, and can be well matched with various ceramic substrates. It has good compatibility with silver and gold conductive tapes and platinum and ruthenium resistors on ceramic substrates. The firing temperature range is wide, the firing film surface is bright and smooth, with strong adhesion, good dielectric properties, high insulation strength and electrical resistance, as well as excellent moisture resistance, heat shock resistance and chemical stability.

Main applications: Used for encapsulation of hybrid circuits, resistor networks, high-voltage resistors, chip resistors, focusing potentiometers, sensitive components, power supply devices, and thick film circuit blocks.