Application of PI silver plated film in the field of flexible electronics: achieving thinner, more durable device design

1、 Introduction

The development of flexible electronic technology has brought revolutionary changes to electronic product design.PI silver plated filmAs a high-performance material, it has received widespread attention and application in the field of flexible electronics due to its unique physical and chemical properties. This article will explore how PI silver plated film can help achieve thinner and more durable equipment design, and provide relevant reference data and experimental data for comparative analysis.

2、 Characteristics of PI silver plated film

（1） Lightness and thinness

• The PI silver plated film has extremely high lightness and thinness, and the thickness of the polyimide (PI) substrate can be as low as a few micrometers, while the thickness of the silver plated layer is also in the nanometer range.

（2） Conductivity

• The conductivity of silver is extremely high, about 6.3 x 10 ^ 7 S/m, therefore PI silver plated film has excellent conductivity.

（3） Corrosion resistance

• Silver has high chemical stability and is not easily reactive with other substances, therefore PI silver plated film has good corrosion resistance.

（4） Flexibility

• PI silver plated filmWhile maintaining high conductivity, it also has excellent flexibility and can withstand multiple bends without affecting performance.

3、 Application of PI Silver Plated Film in Flexible Electronics

（1） Flexible Circuit Board (FPC)

• PI silver plated film is used to make flexible circuit boards, which can significantly reduce the thickness and weight of the circuit board while maintaining high conductivity and corrosion resistance.

（2） Wearable devices

• In wearable devices, PI silver plated film can be used to make flexible sensors and conductive fabrics, making the device thinner, more comfortable, and durable.

（3） Folding screen phone

• PI silver plated film is used to make flexible display components for foldable mobile phones, which can achieve multiple bending of the screen without affecting the display effect.

4、 Experimental research

（1） Experimental Design

1. Sample preparation
   • Advanced Institute (Shenzhen) Technology Co., Ltd. has prepared two types of flexible circuit board samples: sample A uses traditional copper foil material, and sample B uses PI silver plated film material.
2. testing environment
   • Place two samples under different bending conditions for testing.
3. Test project
   • The test content includes resistance change rate, bending life, and corrosion resistance.

（2） Experimental results

1. Resistance change rate
   • After 1000 bends, the resistance change rate of sample A is 10%, while the resistance change rate of sample B is only 2%.
2. Bending life
   • Sample A showed significant performance degradation after 20000 bending cycles, while sample B maintained stable performance after 50000 bending cycles.
3. Corrosion resistance
   • In the salt spray test, sample A showed significant corrosion within 24 hours, while sample B did not show significant corrosion within 72 hours.

（3） Data analysis

• From the experimental results, it can be seen that the PI silver plated film material is superior to traditional copper foil materials in terms of bending performance, corrosion resistance, and conductivity.

5、 Conclusion

PI silver plated film has shown great potential in the field of flexible electronics due to its lightweight, high conductivity, corrosion resistance, and flexibility. Through comparative analysis of experimental data, the following conclusions can be drawn:

• PI silver plated film can significantly improve the lightweight and durability of flexible electronic devices.
• PI silver plated film is superior to traditional materials in terms of bending performance, corrosion resistance, and conductivity, making it suitable for producing high-performance flexible circuit boards and wearable devices.

Advanced Institute (Shenzhen) Technology Co., LtdSignificant achievements have been made in the research and application of PI silver plated film materials, providing strong technical support for the development of flexible electronics. In the future, with the continuous advancement and innovation of technology, PI silver plated film will demonstrate its unique advantages and broad application prospects in more fields.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.