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XJYYB-25系列镀金铜箔，基材为软态压延铜箔（>99.9%纯铜），基材具有良好的导电性，镀金表面电接触性能 优良且具备 的抗电化学腐蚀性，易钎焊。
根据客户需求，我司同时可以生产镀锡，镀银等其他金属镀层满足特殊应用，铜箔厚度10-100微米，幅宽 达到540mm.
XJYYB-25Series gold plated copper foil, base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.
|
幅宽Width |
520±10mm |
卷尺测量Tape measurement |
|
卷长Length |
200m/Roll |
卷尺测量Tape measurement |
|
颜色Color |
金色Gold Yellow |
目测Visual |
|
总厚度Total Thickness |
26µm±10% |
ASTM D1000 |
|
铜箔厚Copper Foil Thickness |
25µm±10% |
ASTM D1000 |
|
镀金层厚度Gold Coating |
0.04µm±0.01 |
ASTM D1000 |
|
镀层结合力Cotaing Bonding Str |
5B |
内部标准Inside Standard |
|
方阻Surface Resistance |
≤0.02 Ω/ㅁ |
Test by MIL-G-83528 |
|
盐雾测试Salt spray test |
24Hrs |
ASTM B117-2003 |
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