SMT 5G TIM, EMI EMC ESD, Insulated transparent wave high thermal conductivity domestic high-end new material

This product is the first domestically developed high-quality two-dimensional boron nitride nanosheets, which have successfully prepared large-area and thickness controllable two-dimensional boron nitride heat dissipation films. It has various excellent characteristics such as electromagnetic wave transmission, high thermal conductivity, high flexibility, low dielectric constant, and low dielectric loss, solving the current problem of SMT in China. The full name of SMT in China is Surface Mount Technology, which means Surface Mount Technology in Chinese. SMT equipment refers to the machines or equipment used in the SMT processing process. Different manufacturers configure different SMT production lines according to their own strength, scale, and customer requirements, which can be divided into semi-automatic SMT production lines and fully automatic SMT production lines. The machine equipment of each SMT production line is not the same, but the following SMT equipment is a relatively complete and rich one. Configuration line. The bottleneck problem faced in the field of electronic packaging and thermal management lies in the possession of internationally advanced TIM thermal management solutions with high assembly density, small size, and light weight of electronic products. The volume and weight of surface mount components are only about 1/10 of traditional plug-in components. Generally, after using SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.
High reliability and strong anti vibration ability. The defect rate of solder joints is low. Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference.
Easy to achieve miniaturization of self-produced products, the previously used perforated plug-in components are no longer able to shrink the functionality of electronic products to be more complete. The integrated circuits (ICs) used no longer have perforated components, especially large-scale, highly integrated ICs, which have to adopt surface mount component products for mass production and automation. Manufacturers need to produce high-quality products at low cost and high output to meet customer needs and strengthen market competitiveness.

Boarding machine: The PCB board is placed in the rack and automatically sent to the suction machine;

Suction board machine: suck the PCB and place it on the track, then transfer it to the solder paste printing machine;

Solder Paste Printing Machine: Accurately leak solder paste or patch adhesive onto the solder pads of PCB, preparing for component mounting. There are roughly three types of printing machines used for SMT: manual printing machines, semi-automatic printing machines, and fully automatic printing machines;

SPI: SPI stands for Solder Paste InspecTIon, also known as solder paste inspection machine in Chinese. It is mainly used to detect the quality of PCB boards printed by solder paste printing machines, and to check the thickness, flatness, printing area, etc. of solder paste printing;

SMT machine: Using a pre edited program on the device to accurately install components onto fixed positions on a printed circuit board. SMT machines can be divided into high-speed SMT machines and multifunctional SMT machines. High speed SMT machines are generally used to mount small chip components, while multifunctional SMT machines are mainly used to mount large components in roll, disk, or tube shapes or opposite components. The characteristic is high mounting accuracy, but the mounting speed is not as fast as high-speed machines;

Docking station: a device for transferring PCB boards;

Reflow soldering: located behind the SMT machine in the SMT production line, providing a heating environment to melt the solder paste on the solder pads, so that surface mounted components and PCB solder pads are firmly bonded together through solder paste alloy;

Bottom board machine: automatically collects PCBA through the transmission track;

AOI： Automatic Optical Identification System, abbreviated as Auto Optical Inspection in English, is commonly used in the electronic industry for appearance inspection of circuit board assembly production lines, replacing manual visual inspection in the past. When performing automatic detection, the machine automatically scans the PCB through a camera, collects images, compares the tested solder joints with qualified parameters in the database, processes the images, checks for defects on the PCB, and displays/marks the defects on the monitor for maintenance personnel to repair;

X-RAY： Mainly used to detect the mounting quality of various industrial components, electronic components, and circuits.

Revitalize and improve production efficiency. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc. Guan Material Production Technology is a top innovative high-tech product in the field of low dimensional material technology in China.