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Screen printed conductive adhesive for FPC shielding
Conductive Adhesive
Heat curing/high adhesive strength/reflow soldering resistance
Top sunshine conductive silver adhesive TS-0240FPC is a modified epoxy conductive adhesive that requires low-temperature storage (around 0 ℃), screen printing type, and conductive adhesive for hot pressing and bonding steel sheets. The conductive adhesive has high bonding strength and excellent conductivity.
Purpose: FPC hot press bonding steel sheet.
Features: Smooth screen printing, good leveling, excellent conductivity, high adhesive strength, and resistance to reflow soldering.
Pre curing characteristics
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Appearance |
Silver |
|
| appearance |
silver gray |
|
| Viscosity |
20-25Pa·s |
Brookfield 52Z ,5rpm |
| viscosity |
||
| Specific gravity |
3.03 |
Cup |
| proportion |
Specific gravity cup GB/T 13354-1992 |
|
| Cure time |
3-4minutes |
180℃-200℃ |
| Curing time |
||
| Storage |
3months |
-5℃-5℃ |
| Storage conditions |
7days |
25℃-30℃ |
Post fixed line characteristics
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Pencil hardness |
2B-6B |
|
| Hardness (pencil hardness) |
||
| Lap shear strength |
32MPa |
Glass/nickel plated copper sheet |
| shear strength |
10mm/min |
|
| Peel strength |
91N/25mm |
Glass/nickel plated copper sheet |
| peel strength |
50mm/min |
|
| Volume resistivity |
0.0001ΩNaN(410TS) 0.0001ΩNaN(450TS) |
180℃*3min |
| Volume resistance |
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