What are the advantages and disadvantages of room temperature curing conductive silver paste and heating curing

Low temperature conductive silver adhesiveIt is an adhesive with certain conductive properties after curing or drying. It is usually composed of a matrix resin and conductive fillers, namely conductive particles, as the main components. Through the adhesive effect of the matrix resin, the conductive particles are combined together to form a conductive path, achieving the conductive connection of the bonded material
Conductive silver adhesiveIt is mainly composed of resin matrix, conductive particles, dispersing additives, and additives Currently, most of the conductive silver adhesives used in the market are filler type
The resin matrix of filler type conductive silver adhesive can, in principle, use various types of binder resin matrices. Commonly used adhesive systems include thermosetting adhesives such as epoxy resin, organosilicon resin, polyimide resin, phenolic resin, polyurethane, acrylic resin, etc These adhesives form a molecular skeleton structure of conductive silver adhesive after curing, providing mechanical and adhesive performance guarantees, and enabling conductive filler particles to form channels Due to its ability to cure at room temperature or below 150 ℃ and its rich formulation and designable properties, epoxy resin based conductive silver adhesives currently dominate
Conductive silver paste requires that the conductive particles themselves have good conductivity and the particle size should be within an appropriate range, which can be added to the conductive silver paste matrix to form a conductive pathConductive fillerIt can be powders of gold, silver, copper, aluminum, zinc, iron, nickel, graphite, and some conductive compounds.

        Conductive adhesiveConductive adhesive, also known as conductive glue, is a special adhesive that can effectively bond various materials and has conductive properties after curing or drying. Conductive adhesive is a special type of conductive polymer composite material with adhesive properties, which is prepared by adding conductive fillers to polymer resins and curing agents. After curing, it has conductivity and is used to connect conductive materials or devices.
Conductive adhesive adds conductive particles to the base resin to make it conductive and adhesive. Therefore, conductive adhesives are generally composed of polymer resins, diluents, curing agents, accelerators, conductive fillers, and other additives. The polymer resins used for conductive adhesives mainly include epoxy resin, silicone, phenolic resin, polyimide, and thermoplastic plastics. Polymer resin is one of the main components of conductive adhesive, and the active groups it contains can undergo curing reactions after adding curing agents. The most researched and widely used polymer resin currently is epoxy resin, which has the advantages of strong adhesion, corrosion resistance, and stable performance. Conductive fillers are the core components of conductive adhesives, so conductive fillers used for conductive adhesives should have inherent impedance and properties such as water resistance, acid resistance, and chemical corrosion resistance. Commonly used types include carbon, metal, and metal oxides. Commonly used conductive particles include silver powder, copper powder, gold powder, silver copper composite powder, nickel powder, carbon black, graphite, and polymer coated metal powder. Among them, polymer coated metal powder is mainly used for anisotropic conductive adhesives.