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Advanced Institute of Technology Conductive Silver AdhesiveThe Yanbo series is a modified epoxy silver adhesive that requires low-temperature storage (around 0 ℃) and can be used for bonding infrared pyroelectric chips. Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, and excellent conductivity.
Purpose: Adhesive bonding of infrared sensor chips
Specialty: Smooth dispensing; The adhesive point does not collapse, does not spread, and has good shape retention; Excellent conductivity; High adhesive strength;
Pre curing characteristics
| Items | Data | Remark | 
| project | Measurement value | Preparing for exams | 
| Appearance | Silver | |
| appearance | silver gray | |
| Viscosity | 10-15Pa•s | Brookfield 52Z ,5rpm | 
| viscosity | ||
| Specific gravity | 3.23 | Cup | 
| proportion | Specific gravity cup GB/T 13354-1992 | |
| Cure time | 30-40minutes | 140℃-150℃ | 
| Curing time | ||
| Storage | 3months | -5℃-5℃ | 
| Storage conditions | 7days | 25℃ | 
  
 
Characteristics after curing
| Items | Data | Remark | 
| project | Measurement value | Preparing for exams | 
| Pencil hardness | 4H-7H | |
| Hardness (pencil hardness) | ||
| Lap shear strength | 30MPa | Glass/nickel plated copper sheet | 
| shear strength | 10mm/min | |
| Peel strength | 91N/25mm | Glass/nickel plated copper sheet | 
| peel strength | 50mm/min | |
| Volume resistivity | 0.0001Ω.cm(410TS) 0.0001Ω.cm(450TS) | 150℃*30min | 
| Volume resistance | 
  
 
 
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