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Organic silicon conductive silver adhesive for SMD crystal oscillator
Conductive Adhesive
Heat curing/high adhesive strength/reflow soldering resistance
Top-sunshineConductive silver adhesiveTS-0230SMD is a modified organic silicone conductive adhesive that requires low-temperature storage (around 0 ℃) and bonding between SMD crystal oscillator base and chip.Organic silicon conductive adhesiveSmooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, excellent conductivity, strong temperature resistance, flexible cured material, and strong earthquake resistance.
Usage: SMD quartz crystal resonator.
Strengths: Smooth dispensing, no collapse or diffusion of adhesive points, good shape retention, excellent conductivity, high bonding strength, long-term high temperature resistance, and excellent earthquake resistance.
Pre curing characteristics
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Appearance |
Silver |
|
appearance |
silver gray |
|
Viscosity |
10-15Pa·s |
Brookfield 52Z ,5rpm |
viscosity |
||
Specific gravity |
3.03 |
Cup |
proportion |
Specific gravity cup GB/T 13354-1992 |
|
UV Cure time |
30-40minutes |
180℃-200℃ |
Curing time |
||
Storage |
3months |
-5℃-5℃ |
Storage conditions |
3days |
25℃-30℃ |
Characteristics after curing
Items |
Data |
Remark |
project |
Measurement value |
Preparing for exams |
Pencil hardness |
4B-6B |
|
Hardness (pencil hardness) |
||
Lap shear strength |
22MPa |
Glass/nickel plated copper sheet |
shear strength |
10mm/min |
|
Peel strength |
71N/25mm |
Glass/nickel plated copper sheet |
peel strength |
50mm/min |
|
Volume resistivity |
0.0001ΩNaN(410TS) 0.0001ΩNaN(450TS) |
180℃*60min |
Volume resistance |
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